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Future Electronics
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News from Future Electronics: |
Advanced eMMC storage solutions
28 February 2025, DSP, Micros & Memory, Future Electronics
Alliance Memory provides advanced NAND flash memory storage solutions that follow the JEDEC eMMC v5.1 standard to meet the growing demand for efficient, high-capacity storage solutions in today’s digital era.
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Power relays for energy management applications
28 February 2025, Power Electronics / Power Management, Future Electronics
The Panasonic Industry HE-R Series is an energy management relay designed for single-phase or 3-phase AC charging units, combining high capacity, high switching, and low operating power into a small size power relay.
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NPU in the most powerful STM32 processor
28 February 2025, DSP, Micros & Memory, Future Electronics
The STM32N6 is STMicroelectronics’ newest and most powerful STM32 and the first to come with the company’s Neural-ART Accelerator, a custom NPU capable of 600 GOPS.
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E-mobility innovation: balancing power, sensors, and connectivity
EMP 2025 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, Future Electronics
The future of e-mobility is being shaped by innovations in power systems, connectivity, and sustainable design, and this article explores key technologies driving the industry forward.
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ST’s biosensing tech enables next-gen wearables
29 November 2024, DSP, Micros & Memory, Future Electronics
The highly integrated biosensor device combines an input channel for cardio and neurological sensing, with motion tracking and embedded AI core, for healthcare and fitness applications.
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1700 V GaN Switcher IC
29 November 2024, Power Electronics / Power Management, Future Electronics
Power Integrations has introduced a new member of its InnoMux-2 family of single-stage regulated multi-output offline power supply ICs, the industry’s first 1700 V gallium nitride switch.
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i.MX RT700 for the AI-enabled edge
31 October 2024, DSP, Micros & Memory, Future Electronics
Designed to enable significant power savings, the highly integrated i.MX RT700 crossover MCU features NXP’s eIQ Neutron Neural Processing Unit, delivering up to 172x AI acceleration at the edge.
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Moulded inductors
31 October 2024, Passive Components, Future Electronics
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.
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32-bit range of MCUs
31 October 2024, DSP, Micros & Memory, Future Electronics
If your design has outgrown the capabilities of 8- or 16-bit MCUs, the PIC32 family delivers easy scalability, enhanced performance, and larger memory options.
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