Mouser Electronics has announced a new eBook in collaboration with Arduino – From Blink to Think: How Arduino UNO Q Helps Designers Go from Idea to Intelligent Product.

UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.

i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.

MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.

Electrostatic discharge performance is influenced by several environmental factors, with relative humidity being one of the most important. This is particularly relevant in South Africa, where seasonal changes can result in significant differences in humidity levels.

In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.

The smallest part on the BOM is usually the one that holds it up. Interconnect, passive and electromechanical components rarely get attention until they are missing. That is starting to change, and it is reshaping how procurement teams think about risk.

AMD Vivado Design Suite 2026.1 is here and features a new tiered licensing model for greater flexibility, new device support, major NoC and QoR improvements, and ease-of-use enhancements for designing with AMD Versal adaptive SoCs.