Electronics Buyers' Guide (EBG) - Directory of the South African Electronics Industry
Prime Technology Corp. SA

Shere AH, Shere, Pretoria East

cell:  
+27 76 880 7800
email:  
[email protected]
url:  
www.primetechnology.us

Iso Certification ISO 9001:2015, AS 9120B, EN 9120, SJAC 9120

Sale of: electronic components including military and aviation, land-based vehicle components and hardware, obsolete and hard-to-find items, stocking long lead-time electronic components. Merchandise and products manufactured in the USA.


Malaysia

tel:
New York

tel:
Shanghai

tel:
South Africa

tel:
Section - Components
-Amplifiers
- audio power
- audio small signal
- current
- operational
- programmable
-Analogue multiplexers
-Analogue multipliers/dividers
-Analogue switches
-Arrays
- diode
- transistor
-Energy metering
-Cables - Multiconductor
- computer, LAN
- instrumentation, control
- multipair
- shielded individual/overall
- temperature extremes
-Cables - coaxial
- flexible
- high temperature
- miniature
- rigid
- semi-rigid
- twin-axial
-Cables - flat
- antenna feed
- printed, ribbon
- woven
-Cables
- Harnesses
- High voltage
- Medical
- Microphone
- Optical fibre
- Power
- Retractile
- Thermocouple
-Installation accessories
- Ducting
- Glands, grommets
- Joining kits
- Lacing cords/ribbons
- Marking systems
- Mounting clips, clamps
- Powerskirting
- Shrink tubing
- Spiral wrap
- Strain reliefs
- Ties
- Zip tubing
-Wires
- Copper braid
- Hook-up
- Litz
- Magnet (winding) wire
- Nickel
- Tinsel
- Wrapping wire
-AC
-Battery replacement (high energy)
-Capacitor networks
-Ceramic
- axial lead
- chip format
- DIP
- high-Q
- radial lead
-Electrolytic
- aluminium
- chip format
- high ripple
- tantalum
-Feed-through
-Film (foil/metallised)
- chip format
- polycarbonate
- polyester
- polypropylene
- polystyrene
- polysulfone
- teflon
-High voltage
-Memory support
-Motor start capacitors
-Paper (foil and metallised)
-RFI suppression
-Board-to-board/backplane
- Board-to-board stacking
- Elastomeric
- High density (<2 mm)
- High speed data
- Metric spacing
- Milspec
- One piece
- Surface mount
- Two piece
-Board-to-cable/wire
- High density (<2 mm)
- IDC discrete wire
- Mass terminated (IDC) ribbon
- Milspec
- Receptacles and headers
- Surface mount
-Cable-to-cable/panel - Circular
- audio, video
- DIN
- hybrid (mixed contact)
- milspec
- modular insert
- power
- professional
-Cable-to-cable/panel - D-Subminiature
- accessories
- high density
- microminiature
- standard
-Cable-to-cable/panel - rectangular
- high density
- hybrid (mixed contact)
- low power, I/O
- milspec
- power
-Coaxial cable connectors
- Between series adapters
- BNC/TNC Series
- C Series
- Milspec
- Miniature (semi-rigid)
- N Series
- SHV (safe HV) Series
- SMA/SMB/SMC Series
- Std/miniature UHF
- Triaxial
- Twinaxial
-Connector support
- Cable assembly service
- Cable preparation tooling
- Database available
- Termination tooling
-Optical fibre
- Fibre bundle
- Hybrid (fibre + copper)
- Single fibre
-Special applications
- Automotive
- Avionics
- Elastomeric stacking
- EMI-filtered
- Flameproof
- Harsh environment
- High current
- High temperature
- High voltage
- Shielded
- Thermocouple
- Underwater
- Vehicle
-BiCMOS
-CMOS
-Converters
- ADCs
- Code
- DACs
-Data acquisition systems ICs
-Encoders/decoders
-Graphics ICs
-Image processing
-Interface ICs
-Inverters
-Management ICs
-Microcomputer chipsets
-RS232 drivers
-Schmitt triggers
-SCSI chips
-Translators (TTL-CMOS-ECL)
-TTL
-Diodes
- Arrays
- Fast recovery
- Rectifier
- Schottky
-Power
- MOSFET
-Transistors
- Darlington
- Dual complementary
- HF/video
- High voltage
- Low noise
- VHF/UHF
-Inductors
- Audio frequency (filter, etc)
- Common mode
- High frequency (RF,IF,etc)
- Moulded RF chokes
- SMD chips
- Toroidal
- Transductors
-Transformers - power
- Constant voltage
- High voltage
- Mains input
- Switchmode (DC-DC)
- Toroidal
-Transformers - signal
- Telecom specialised
-Converters
- frequency-voltage
-Current transmitter ICs
-Drivers
- power MOSFET
- relay
- solenoid
- stepper motor
-Electricity metering ICs
-Multiplexers
-Power op amps
-Features available
- On-chip flash
- On-chip ROM/EPROM
- On-chip SRAM
- OTP
- Real-time clock
-Processor types
- Digital signal processors
-Battery holders
-Beryllium copper
-Ceramic parts
-Fasteners
-Magnetic cores
- ferrite transformer
-Screws and fasteners
-Carbon composition
-Carbon film
-Digital potentiometers (see Digital IC section)
-Wirewound
-AC-DC converters (IC)
-DC-DC converters (IC)
-PWM controllers
-Voltage regulators
- Adjustable
-Protection relays
- Over/under-frequency
-Electromagnetic
- Automotive
- General purpose, control
- Heavy duty/power switching
- High voltage
- Latching
- Surface mounting
-Reed relays
- Microminiature
-Solid-state
- General purpose
-Ceramic, bulk
-Film
- Carbon
- Metal film
-Surface mount
- Chip
- Power
-EEPROM (electrically erasable)
-EPROM (OTP)
-EPROM (UV erasable)
-Flash EEPROM
-Flash EPROM
Electronics & communications technology news:
Nordic expands nRF Cloud with firmware vulnerability scanning
29 June 2026, Computer/Embedded Technology, RF Design

nRF Cloud identifies vulnerabilities in firmware and shows exactly which deployed devices are affected, empowering device manufacturers to address EU Cyber Resilience Act requirements.

Quality batteries are critical for IIoT
29 June 2026, Power Electronics / Power Management, Uniross Batteries

Batteries intended for use in industrial operations must indeed offer complete reliability under extreme environmental conditions, resistance to vibration and harsh environments.

Industrial-grade ESP32-S3 controller
29 June 2026, DSP, Micros & Memory

Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

Next-gen smart module powers intelligence at the edge
29 June 2026, DSP, Micros & Memory, iCorp Technologies

Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.

200 W of power in a space-saving design
29 June 2026, Manufacturing / Production Technology, Hardware & Services, Vepac Electronics

The Hakko FX-972 Soldering Station delivers high-performance soldering in a compact package, making it suitable for a wide range of soldering applications.

GigaDevice expands optical communication portfolio
29 June 2026, Telecoms, Datacoms, Wireless, IoT, NuVision Electronics

GigaDevice has introduced the new GD32E512 and GD32E252 series MCUs specifically designed for optical module applications.

Industrial connectivity without compromise
29 June 2026, Telecoms, Datacoms, Wireless, IoT

The IR315 combines 4G LTE, Wi-Fi, Ethernet, and VPN technologies into a rugged, industrial-grade platform that enables seamless connectivity across a wide range of applications.

RF filters explained
29 June 2026, Telecoms, Datacoms, Wireless, IoT, RFiber Solutions

As RF environments become increasingly crowded, RF filters play a critical role in maintaining signal quality, improving system performance, and ensuring reliable operation.

visit www.dataweek.co.za

         
 
 
             
   
     
Copyright © Technews Publishing (Pty) Ltd. All rights reserved.