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Prime Technology Corp. SA
Shere AH, Shere, Pretoria East
Iso Certification ISO 9001:2015, AS 9120B, EN 9120, SJAC 9120
Sale of: electronic components including military and aviation, land-based vehicle components and hardware, obsolete and hard-to-find items, stocking long lead-time electronic components. Merchandise and products manufactured in the USA.
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Malaysia
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New York
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Shanghai
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South Africa
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Section - Components
-Amplifiers
- audio power
- audio small signal
- current
- operational
- programmable
-Analogue multiplexers
-Analogue multipliers/dividers
-Analogue switches
-Arrays
- diode
- transistor
-Energy metering
-Cables - Multiconductor
- computer, LAN
- instrumentation, control
- multipair
- shielded individual/overall
- temperature extremes
-Cables - coaxial
- flexible
- high temperature
- miniature
- rigid
- semi-rigid
- twin-axial
-Cables - flat
- antenna feed
- printed, ribbon
- woven
-Cables
- Harnesses
- High voltage
- Medical
- Microphone
- Optical fibre
- Power
- Retractile
- Thermocouple
-Installation accessories
- Ducting
- Glands, grommets
- Joining kits
- Lacing cords/ribbons
- Marking systems
- Mounting clips, clamps
- Powerskirting
- Shrink tubing
- Spiral wrap
- Strain reliefs
- Ties
- Zip tubing
-Wires
- Copper braid
- Hook-up
- Litz
- Magnet (winding) wire
- Nickel
- Tinsel
- Wrapping wire
-AC
-Battery replacement (high energy)
-Capacitor networks
-Ceramic
- axial lead
- chip format
- DIP
- high-Q
- radial lead
-Electrolytic
- aluminium
- chip format
- high ripple
- tantalum
-Feed-through
-Film (foil/metallised)
- chip format
- polycarbonate
- polyester
- polypropylene
- polystyrene
- polysulfone
- teflon
-High voltage
-Memory support
-Motor start capacitors
-Paper (foil and metallised)
-RFI suppression
-Board-to-board/backplane
- Board-to-board stacking
- Elastomeric
- High density (<2 mm)
- High speed data
- Metric spacing
- Milspec
- One piece
- Surface mount
- Two piece
-Board-to-cable/wire
- High density (<2 mm)
- IDC discrete wire
- Mass terminated (IDC) ribbon
- Milspec
- Receptacles and headers
- Surface mount
-Cable-to-cable/panel - Circular
- audio, video
- DIN
- hybrid (mixed contact)
- milspec
- modular insert
- power
- professional
-Cable-to-cable/panel - D-Subminiature
- accessories
- high density
- microminiature
- standard
-Cable-to-cable/panel - rectangular
- high density
- hybrid (mixed contact)
- low power, I/O
- milspec
- power
-Coaxial cable connectors
- Between series adapters
- BNC/TNC Series
- C Series
- Milspec
- Miniature (semi-rigid)
- N Series
- SHV (safe HV) Series
- SMA/SMB/SMC Series
- Std/miniature UHF
- Triaxial
- Twinaxial
-Connector support
- Cable assembly service
- Cable preparation tooling
- Database available
- Termination tooling
-Optical fibre
- Fibre bundle
- Hybrid (fibre + copper)
- Single fibre
-Special applications
- Automotive
- Avionics
- Elastomeric stacking
- EMI-filtered
- Flameproof
- Harsh environment
- High current
- High temperature
- High voltage
- Shielded
- Thermocouple
- Underwater
- Vehicle
-BiCMOS
-CMOS
-Converters
- ADCs
- Code
- DACs
-Data acquisition systems ICs
-Encoders/decoders
-Graphics ICs
-Image processing
-Interface ICs
-Inverters
-Management ICs
-Microcomputer chipsets
-RS232 drivers
-Schmitt triggers
-SCSI chips
-Translators (TTL-CMOS-ECL)
-TTL
-Diodes
- Arrays
- Fast recovery
- Rectifier
- Schottky
-Power
- MOSFET
-Transistors
- Darlington
- Dual complementary
- HF/video
- High voltage
- Low noise
- VHF/UHF
-Inductors
- Audio frequency (filter, etc)
- Common mode
- High frequency (RF,IF,etc)
- Moulded RF chokes
- SMD chips
- Toroidal
- Transductors
-Transformers - power
- Constant voltage
- High voltage
- Mains input
- Switchmode (DC-DC)
- Toroidal
-Transformers - signal
- Telecom specialised
-Converters
- frequency-voltage
-Current transmitter ICs
-Drivers
- power MOSFET
- relay
- solenoid
- stepper motor
-Electricity metering ICs
-Multiplexers
-Power op amps
-Features available
- On-chip flash
- On-chip ROM/EPROM
- On-chip SRAM
- OTP
- Real-time clock
-Processor types
- Digital signal processors
-Battery holders
-Beryllium copper
-Ceramic parts
-Fasteners
-Magnetic cores
- ferrite transformer
-Screws and fasteners
-Carbon composition
-Carbon film
-Digital potentiometers (see Digital IC section)
-Wirewound
-AC-DC converters (IC)
-DC-DC converters (IC)
-PWM controllers
-Voltage regulators
- Adjustable
-Protection relays
- Over/under-frequency
-Electromagnetic
- Automotive
- General purpose, control
- Heavy duty/power switching
- High voltage
- Latching
- Surface mounting
-Reed relays
- Microminiature
-Solid-state
- General purpose
-Ceramic, bulk
-Film
- Carbon
- Metal film
-Surface mount
- Chip
- Power
-EEPROM (electrically erasable)
-EPROM (OTP)
-EPROM (UV erasable)
-Flash EEPROM
-Flash EPROM
Electronics & communications technology news: |
Ideal entry point into edge AI
29 May 2026, AI & ML, Avnet Silica
congatec has released new COM Express modules with Intel Core Series 3 processors for cost- and energy-optimised embedded computing applications.
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Robotics platform powers intelligent systems
29 May 2026, AI & ML, Vepac Electronics
The CEXD-INTRBL open robotics development system combines high-performance AI processing, sensor integration, and motion control into a compact embedded platform.
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Ultra-low-power smart metering
29 May 2026, Analogue, Mixed Signal, LSI, EBV Electrolink
ScioSense’s UFC23 sensor combines improved resolution and offset stability with ultra-low standby current, enabling high-end battery-powered water, heat, gas and leak detection meter designs. |
What happens when trust can no longer live only in software?
29 May 2026, Electronics Technology, Computer/Embedded Technology
[Sponsored] For years, many enterprise security architectures treated hardware primarily as the execution layer, while software handled authentication, access control and trust decisions. |
Introducing STM32CubeMX2
29 May 2026, Design Automation, Altron Arrow
STMicroelectronics has launched STM32CubeMX2, a new evolution of its popular configuration and code generation tool for STM32 microcontrollers. |
ESP32-S31 for advanced IoT
29 May 2026, DSP, Micros & Memory, iCorp Technologies
At the heart of the device is a dual-core 32-bit RISC-V MCU operating at up to 320 MHz, delivering 6,86 CoreMark/MHz performance with MMU support for efficient memory management.
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SensorGPT speeds intelligent IoT deployment
29 May 2026, AI & ML
TDK has introduced SensorGPT, a new technology designed to accelerate the deployment of intelligent edge AI and smart IoT applications by dramatically reducing reliance on real-world sensor data.
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Industrial vibration sensing simplified
29 May 2026, Analogue, Mixed Signal, LSI, Altron Arrow
The IIS3DWBG1 from STMicroelectronics is a high performance, three-axis digital vibration sensor engineered for demanding industrial applications where accurate motion monitoring is essential.
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