Electronics Buyers' Guide (EBG) - Directory of the South African Electronics Industry
Prime Technology Corp. SA

Shere AH, Shere, Pretoria East

cell:  
+27 76 880 7800
email:  
[email protected]
url:  
www.primetechnology.us

Iso Certification ISO 9001:2015, AS 9120B, EN 9120, SJAC 9120

Sale of: electronic components including military and aviation, land-based vehicle components and hardware, obsolete and hard-to-find items, stocking long lead-time electronic components. Merchandise and products manufactured in the USA.


Malaysia

tel:
New York

tel:
Shanghai

tel:
South Africa

tel:
Section - Components
-Amplifiers
- audio power
- audio small signal
- current
- operational
- programmable
-Analogue multiplexers
-Analogue multipliers/dividers
-Analogue switches
-Arrays
- diode
- transistor
-Energy metering
-Cables - Multiconductor
- computer, LAN
- instrumentation, control
- multipair
- shielded individual/overall
- temperature extremes
-Cables - coaxial
- flexible
- high temperature
- miniature
- rigid
- semi-rigid
- twin-axial
-Cables - flat
- antenna feed
- printed, ribbon
- woven
-Cables
- Harnesses
- High voltage
- Medical
- Microphone
- Optical fibre
- Power
- Retractile
- Thermocouple
-Installation accessories
- Ducting
- Glands, grommets
- Joining kits
- Lacing cords/ribbons
- Marking systems
- Mounting clips, clamps
- Powerskirting
- Shrink tubing
- Spiral wrap
- Strain reliefs
- Ties
- Zip tubing
-Wires
- Copper braid
- Hook-up
- Litz
- Magnet (winding) wire
- Nickel
- Tinsel
- Wrapping wire
-AC
-Battery replacement (high energy)
-Capacitor networks
-Ceramic
- axial lead
- chip format
- DIP
- high-Q
- radial lead
-Electrolytic
- aluminium
- chip format
- high ripple
- tantalum
-Feed-through
-Film (foil/metallised)
- chip format
- polycarbonate
- polyester
- polypropylene
- polystyrene
- polysulfone
- teflon
-High voltage
-Memory support
-Motor start capacitors
-Paper (foil and metallised)
-RFI suppression
-Board-to-board/backplane
- Board-to-board stacking
- Elastomeric
- High density (<2 mm)
- High speed data
- Metric spacing
- Milspec
- One piece
- Surface mount
- Two piece
-Board-to-cable/wire
- High density (<2 mm)
- IDC discrete wire
- Mass terminated (IDC) ribbon
- Milspec
- Receptacles and headers
- Surface mount
-Cable-to-cable/panel - Circular
- audio, video
- DIN
- hybrid (mixed contact)
- milspec
- modular insert
- power
- professional
-Cable-to-cable/panel - D-Subminiature
- accessories
- high density
- microminiature
- standard
-Cable-to-cable/panel - rectangular
- high density
- hybrid (mixed contact)
- low power, I/O
- milspec
- power
-Coaxial cable connectors
- Between series adapters
- BNC/TNC Series
- C Series
- Milspec
- Miniature (semi-rigid)
- N Series
- SHV (safe HV) Series
- SMA/SMB/SMC Series
- Std/miniature UHF
- Triaxial
- Twinaxial
-Connector support
- Cable assembly service
- Cable preparation tooling
- Database available
- Termination tooling
-Optical fibre
- Fibre bundle
- Hybrid (fibre + copper)
- Single fibre
-Special applications
- Automotive
- Avionics
- Elastomeric stacking
- EMI-filtered
- Flameproof
- Harsh environment
- High current
- High temperature
- High voltage
- Shielded
- Thermocouple
- Underwater
- Vehicle
-BiCMOS
-CMOS
-Converters
- ADCs
- Code
- DACs
-Data acquisition systems ICs
-Encoders/decoders
-Graphics ICs
-Image processing
-Interface ICs
-Inverters
-Management ICs
-Microcomputer chipsets
-RS232 drivers
-Schmitt triggers
-SCSI chips
-Translators (TTL-CMOS-ECL)
-TTL
-Diodes
- Arrays
- Fast recovery
- Rectifier
- Schottky
-Power
- MOSFET
-Transistors
- Darlington
- Dual complementary
- HF/video
- High voltage
- Low noise
- VHF/UHF
-Inductors
- Audio frequency (filter, etc)
- Common mode
- High frequency (RF,IF,etc)
- Moulded RF chokes
- SMD chips
- Toroidal
- Transductors
-Transformers - power
- Constant voltage
- High voltage
- Mains input
- Switchmode (DC-DC)
- Toroidal
-Transformers - signal
- Telecom specialised
-Converters
- frequency-voltage
-Current transmitter ICs
-Drivers
- power MOSFET
- relay
- solenoid
- stepper motor
-Electricity metering ICs
-Multiplexers
-Power op amps
-Features available
- On-chip flash
- On-chip ROM/EPROM
- On-chip SRAM
- OTP
- Real-time clock
-Processor types
- Digital signal processors
-Battery holders
-Beryllium copper
-Ceramic parts
-Fasteners
-Magnetic cores
- ferrite transformer
-Screws and fasteners
-Carbon composition
-Carbon film
-Digital potentiometers (see Digital IC section)
-Wirewound
-AC-DC converters (IC)
-DC-DC converters (IC)
-PWM controllers
-Voltage regulators
- Adjustable
-Protection relays
- Over/under-frequency
-Electromagnetic
- Automotive
- General purpose, control
- Heavy duty/power switching
- High voltage
- Latching
- Surface mounting
-Reed relays
- Microminiature
-Solid-state
- General purpose
-Ceramic, bulk
-Film
- Carbon
- Metal film
-Surface mount
- Chip
- Power
-EEPROM (electrically erasable)
-EPROM (OTP)
-EPROM (UV erasable)
-Flash EEPROM
-Flash EPROM
Electronics & communications technology news:
Africa Energy Indaba announces opening plenary panel
EMP 2026 Electronics Manufacturing & Production Handbook, Events

The Africa Energy Indaba will open its 2026 Conference with a high-level plenary panel addressing one of the continent’s most urgent challenges: Energy Access and Energy Poverty – Mission 300M.

Understanding solder dross: causes and control strategies
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, Editor's Choice, Truth Electronic Manufacturing

Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

A new era in placement technology
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, Priben

The SIPLACE V from ASMPT marks a new era in SMT placement technology, delivering a significant performance boost for modern electronics manufacturers.

General-purpose chip mounter
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, ZETECH ONE

The Hanwha Semitech XM520 is a high-performance, general-purpose chip mounter engineered for flexible, efficient SMT assembly.

Flexible placement machine
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, Testerion

Fuji’s AIMEXR placement machine has been developed to be an all-rounder that is able to realise flexible and stable production from NPI to mass production.

PCB depaneling machine
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, Hot Tools

The PCBS-400V industrial linear blade PCB depaneling machine is engineered for manufacturers who demand clean separation, repeatable accuracy, and dependable throughput in high volume electronics production.

Versatile wave soldering
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, MyKay Tronics

The EMST Stallion fc - PLC is a highly capable wave soldering machine engineered for precision and productivity in electronics manufacturing.

Electrostatic discharge chairs
EMP 2026 Electronics Manufacturing & Production Handbook, Circuit & System Protection, Actum

An ESD chair forms an integral part of grounding within the electrostatic discharge protected area to prevent potential damage to products.

visit www.dataweek.co.za

         
 
 
             
   
     
Copyright © Technews Publishing (Pty) Ltd. All rights reserved.