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Prime Technology Corp. SA
Shere AH, Shere, Pretoria East
Iso Certification ISO 9001:2015, AS 9120B, EN 9120, SJAC 9120
Sale of: electronic components including military and aviation, land-based vehicle components and hardware, obsolete and hard-to-find items, stocking long lead-time electronic components. Merchandise and products manufactured in the USA.
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Malaysia
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New York
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Shanghai
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South Africa
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Section - Components
-Amplifiers
- audio power
- audio small signal
- current
- operational
- programmable
-Analogue multiplexers
-Analogue multipliers/dividers
-Analogue switches
-Arrays
- diode
- transistor
-Energy metering
-Cables - Multiconductor
- computer, LAN
- instrumentation, control
- multipair
- shielded individual/overall
- temperature extremes
-Cables - coaxial
- flexible
- high temperature
- miniature
- rigid
- semi-rigid
- twin-axial
-Cables - flat
- antenna feed
- printed, ribbon
- woven
-Cables
- Harnesses
- High voltage
- Medical
- Microphone
- Optical fibre
- Power
- Retractile
- Thermocouple
-Installation accessories
- Ducting
- Glands, grommets
- Joining kits
- Lacing cords/ribbons
- Marking systems
- Mounting clips, clamps
- Powerskirting
- Shrink tubing
- Spiral wrap
- Strain reliefs
- Ties
- Zip tubing
-Wires
- Copper braid
- Hook-up
- Litz
- Magnet (winding) wire
- Nickel
- Tinsel
- Wrapping wire
-AC
-Battery replacement (high energy)
-Capacitor networks
-Ceramic
- axial lead
- chip format
- DIP
- high-Q
- radial lead
-Electrolytic
- aluminium
- chip format
- high ripple
- tantalum
-Feed-through
-Film (foil/metallised)
- chip format
- polycarbonate
- polyester
- polypropylene
- polystyrene
- polysulfone
- teflon
-High voltage
-Memory support
-Motor start capacitors
-Paper (foil and metallised)
-RFI suppression
-Board-to-board/backplane
- Board-to-board stacking
- Elastomeric
- High density (<2 mm)
- High speed data
- Metric spacing
- Milspec
- One piece
- Surface mount
- Two piece
-Board-to-cable/wire
- High density (<2 mm)
- IDC discrete wire
- Mass terminated (IDC) ribbon
- Milspec
- Receptacles and headers
- Surface mount
-Cable-to-cable/panel - Circular
- audio, video
- DIN
- hybrid (mixed contact)
- milspec
- modular insert
- power
- professional
-Cable-to-cable/panel - D-Subminiature
- accessories
- high density
- microminiature
- standard
-Cable-to-cable/panel - rectangular
- high density
- hybrid (mixed contact)
- low power, I/O
- milspec
- power
-Coaxial cable connectors
- Between series adapters
- BNC/TNC Series
- C Series
- Milspec
- Miniature (semi-rigid)
- N Series
- SHV (safe HV) Series
- SMA/SMB/SMC Series
- Std/miniature UHF
- Triaxial
- Twinaxial
-Connector support
- Cable assembly service
- Cable preparation tooling
- Database available
- Termination tooling
-Optical fibre
- Fibre bundle
- Hybrid (fibre + copper)
- Single fibre
-Special applications
- Automotive
- Avionics
- Elastomeric stacking
- EMI-filtered
- Flameproof
- Harsh environment
- High current
- High temperature
- High voltage
- Shielded
- Thermocouple
- Underwater
- Vehicle
-BiCMOS
-CMOS
-Converters
- ADCs
- Code
- DACs
-Data acquisition systems ICs
-Encoders/decoders
-Graphics ICs
-Image processing
-Interface ICs
-Inverters
-Management ICs
-Microcomputer chipsets
-RS232 drivers
-Schmitt triggers
-SCSI chips
-Translators (TTL-CMOS-ECL)
-TTL
-Diodes
- Arrays
- Fast recovery
- Rectifier
- Schottky
-Power
- MOSFET
-Transistors
- Darlington
- Dual complementary
- HF/video
- High voltage
- Low noise
- VHF/UHF
-Inductors
- Audio frequency (filter, etc)
- Common mode
- High frequency (RF,IF,etc)
- Moulded RF chokes
- SMD chips
- Toroidal
- Transductors
-Transformers - power
- Constant voltage
- High voltage
- Mains input
- Switchmode (DC-DC)
- Toroidal
-Transformers - signal
- Telecom specialised
-Converters
- frequency-voltage
-Current transmitter ICs
-Drivers
- power MOSFET
- relay
- solenoid
- stepper motor
-Electricity metering ICs
-Multiplexers
-Power op amps
-Features available
- On-chip flash
- On-chip ROM/EPROM
- On-chip SRAM
- OTP
- Real-time clock
-Processor types
- Digital signal processors
-Battery holders
-Beryllium copper
-Ceramic parts
-Fasteners
-Magnetic cores
- ferrite transformer
-Screws and fasteners
-Carbon composition
-Carbon film
-Digital potentiometers (see Digital IC section)
-Wirewound
-AC-DC converters (IC)
-DC-DC converters (IC)
-PWM controllers
-Voltage regulators
- Adjustable
-Protection relays
- Over/under-frequency
-Electromagnetic
- Automotive
- General purpose, control
- Heavy duty/power switching
- High voltage
- Latching
- Surface mounting
-Reed relays
- Microminiature
-Solid-state
- General purpose
-Ceramic, bulk
-Film
- Carbon
- Metal film
-Surface mount
- Chip
- Power
-EEPROM (electrically erasable)
-EPROM (OTP)
-EPROM (UV erasable)
-Flash EEPROM
-Flash EPROM
Electronics & communications technology news: |
Successful Proteus training conference
30 March 2026, News, Dizzy Enterprises
Dizzy Enterprises recently hosted two hands-on Proteus Training Conferences, bringing together electronics professionals, designers, and enthusiasts to explore the latest capabilities of the Proteus Design Suite from Labcenter Electronics. |
Analogue reservoir AI chip capable of real-time learning
28 April 2026, AI & ML, Altron Arrow
TDK Corporation has jointly developed a prototype of a reservoir AI chip using an analogue electronic circuit that mimics the cerebellum with Hokkaido University. |
Compact cellular IoT SiP with GNSS
30 March 2026, Telecoms, Datacoms, Wireless, IoT, RF Design
Combining low-power connectivity, edge processing, and positioning capabilities in a compact module, Nordic’s nRF9151 targets applications such as asset tracking, smart metering, industrial monitoring, and smart city infrastructure. |
HackRF Pro advances Open SDR performance
28 April 2026, Telecoms, Datacoms, Wireless, IoT, IOT Electronics
Designed for engineers, researchers, and radio enthusiasts alike, the HackRF Pro can transmit and receive signals across a wide frequency range of 100 kHz to 6 GHz, making it a versatile tool for testing and developing modern and emerging radio technologies. |
Deterministic high-speed Ethernet
28 April 2026, Telecoms, Datacoms, Wireless, IoT
The Fraunhofer Institute for Photonic Microsystems IPMS has developed a new 10G TSN endpoint IP Core, enabling deterministic real-time communication at data rates of up to 10 Gbit/s. |
Powering the IoT
28 April 2026, Power Electronics / Power Management, Uniross Batteries
Choosing the right battery is not simply a technical detail, but a defining factor in the longevity and cost-effectiveness of any IoT deployment. |
Enabling the next generation of high-performance wireless designs
30 March 2026, Telecoms, Datacoms, Wireless, IoT, iCorp Technologies
Espressif Systems has expanded its wireless connectivity portfolio with the introduction of the ESP32-E22, a high-performance connectivity co-processor designed for next generation embedded and IoT systems. |
Intelligent high-precision digital deposition platform
30 March 2026, Manufacturing / Production Technology, Hardware & Services
ioTech has introduced the io600, a next generation digital deposition platform designed to bring intelligence, precision, and scalability to modern electronics manufacturing. |
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