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Prime Technology Corp. SA
Shere AH, Shere, Pretoria East
Iso Certification ISO 9001:2015, AS 9120B, EN 9120, SJAC 9120
Sale of: electronic components including military and aviation, land-based vehicle components and hardware, obsolete and hard-to-find items, stocking long lead-time electronic components. Merchandise and products manufactured in the USA.
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Malaysia
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New York
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Shanghai
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South Africa
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Section - Components
-Amplifiers
- audio power
- audio small signal
- current
- operational
- programmable
-Analogue multiplexers
-Analogue multipliers/dividers
-Analogue switches
-Arrays
- diode
- transistor
-Energy metering
-Cables - Multiconductor
- computer, LAN
- instrumentation, control
- multipair
- shielded individual/overall
- temperature extremes
-Cables - coaxial
- flexible
- high temperature
- miniature
- rigid
- semi-rigid
- twin-axial
-Cables - flat
- antenna feed
- printed, ribbon
- woven
-Cables
- Harnesses
- High voltage
- Medical
- Microphone
- Optical fibre
- Power
- Retractile
- Thermocouple
-Installation accessories
- Ducting
- Glands, grommets
- Joining kits
- Lacing cords/ribbons
- Marking systems
- Mounting clips, clamps
- Powerskirting
- Shrink tubing
- Spiral wrap
- Strain reliefs
- Ties
- Zip tubing
-Wires
- Copper braid
- Hook-up
- Litz
- Magnet (winding) wire
- Nickel
- Tinsel
- Wrapping wire
-AC
-Battery replacement (high energy)
-Capacitor networks
-Ceramic
- axial lead
- chip format
- DIP
- high-Q
- radial lead
-Electrolytic
- aluminium
- chip format
- high ripple
- tantalum
-Feed-through
-Film (foil/metallised)
- chip format
- polycarbonate
- polyester
- polypropylene
- polystyrene
- polysulfone
- teflon
-High voltage
-Memory support
-Motor start capacitors
-Paper (foil and metallised)
-RFI suppression
-Board-to-board/backplane
- Board-to-board stacking
- Elastomeric
- High density (<2 mm)
- High speed data
- Metric spacing
- Milspec
- One piece
- Surface mount
- Two piece
-Board-to-cable/wire
- High density (<2 mm)
- IDC discrete wire
- Mass terminated (IDC) ribbon
- Milspec
- Receptacles and headers
- Surface mount
-Cable-to-cable/panel - Circular
- audio, video
- DIN
- hybrid (mixed contact)
- milspec
- modular insert
- power
- professional
-Cable-to-cable/panel - D-Subminiature
- accessories
- high density
- microminiature
- standard
-Cable-to-cable/panel - rectangular
- high density
- hybrid (mixed contact)
- low power, I/O
- milspec
- power
-Coaxial cable connectors
- Between series adapters
- BNC/TNC Series
- C Series
- Milspec
- Miniature (semi-rigid)
- N Series
- SHV (safe HV) Series
- SMA/SMB/SMC Series
- Std/miniature UHF
- Triaxial
- Twinaxial
-Connector support
- Cable assembly service
- Cable preparation tooling
- Database available
- Termination tooling
-Optical fibre
- Fibre bundle
- Hybrid (fibre + copper)
- Single fibre
-Special applications
- Automotive
- Avionics
- Elastomeric stacking
- EMI-filtered
- Flameproof
- Harsh environment
- High current
- High temperature
- High voltage
- Shielded
- Thermocouple
- Underwater
- Vehicle
-BiCMOS
-CMOS
-Converters
- ADCs
- Code
- DACs
-Data acquisition systems ICs
-Encoders/decoders
-Graphics ICs
-Image processing
-Interface ICs
-Inverters
-Management ICs
-Microcomputer chipsets
-RS232 drivers
-Schmitt triggers
-SCSI chips
-Translators (TTL-CMOS-ECL)
-TTL
-Diodes
- Arrays
- Fast recovery
- Rectifier
- Schottky
-Power
- MOSFET
-Transistors
- Darlington
- Dual complementary
- HF/video
- High voltage
- Low noise
- VHF/UHF
-Inductors
- Audio frequency (filter, etc)
- Common mode
- High frequency (RF,IF,etc)
- Moulded RF chokes
- SMD chips
- Toroidal
- Transductors
-Transformers - power
- Constant voltage
- High voltage
- Mains input
- Switchmode (DC-DC)
- Toroidal
-Transformers - signal
- Telecom specialised
-Converters
- frequency-voltage
-Current transmitter ICs
-Drivers
- power MOSFET
- relay
- solenoid
- stepper motor
-Electricity metering ICs
-Multiplexers
-Power op amps
-Features available
- On-chip flash
- On-chip ROM/EPROM
- On-chip SRAM
- OTP
- Real-time clock
-Processor types
- Digital signal processors
-Battery holders
-Beryllium copper
-Ceramic parts
-Fasteners
-Magnetic cores
- ferrite transformer
-Screws and fasteners
-Carbon composition
-Carbon film
-Digital potentiometers (see Digital IC section)
-Wirewound
-AC-DC converters (IC)
-DC-DC converters (IC)
-PWM controllers
-Voltage regulators
- Adjustable
-Protection relays
- Over/under-frequency
-Electromagnetic
- Automotive
- General purpose, control
- Heavy duty/power switching
- High voltage
- Latching
- Surface mounting
-Reed relays
- Microminiature
-Solid-state
- General purpose
-Ceramic, bulk
-Film
- Carbon
- Metal film
-Surface mount
- Chip
- Power
-EEPROM (electrically erasable)
-EPROM (OTP)
-EPROM (UV erasable)
-Flash EEPROM
-Flash EPROM
Electronics & communications technology news: |
Innovative South African electronics system makes overseas debut
EMP 2026 Electronics Manufacturing & Production Handbook, News
Pretoria-based electronics company Etion Create is showing a new range of innovative solutions, including cybersecurity systems at the third edition of World Defense Show (WDS2026) in Riyadh, Saudi Arabia. |
The trillion-dollar energy opportunity in focus at the Africa Energy Indaba
27 November 2025, Events
The Indaba convenes senior government leaders, utilities, regulators, project developers, financiers, DFIs, investors, and technology providers from across Africa and the world to engage directly on investment-ready energy projects, enabling policy frameworks, and the partnerships required to unlock delivery at scale. |
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, MyKay Tronics
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry. |
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, Editor's Choice, Testerion
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
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High-speed, high-resolution material deposition system
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services
ioTech recently unveiled the io600 inline digital laser material deposition system at productronica 2025. |
PCB graphical repair system
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, Truth Electronic Manufacturing
The GRS550 from Polar is a flying probe PCB repair system, designed to assist in repair and recovery of expensive boards with hard-to-find faults. |
Precision PCB cleaning system
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, Electronic Industry Supplies
The PBT Works HyperSWASH III is a top-tier automatic PCB cleaning system engineered for precision, high throughput, and advanced process control in modern SMT production. |
Conductive ESD footwear
EMP 2026 Electronics Manufacturing & Production Handbook, Circuit & System Protection, Actum
Conductive ESD footwear is used in conjunction with other grounding devices, such as a wrist strap, cord, and ESD surface mats, to provide a continuous path to ground. |
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