|
|
Prime Technology Corp. SA
Shere AH, Shere, Pretoria East, Pretoria
Iso Certification ISO 9001:2015, AS 9120B, EN 9120, SJAC 9120
Sale of: military and aviation electronic components, land-based vehicle components, obsolete and hard-to-find items, long lead-time electronic components. Merchandise and products manufactured in the USA.
|
|
Malaysia
tel:
|
New York
tel:
|
|
Shanghai
tel:
|
South Africa
tel:
|
Section - Components
-Amplifiers
- audio power
- audio small signal
- current
- operational
- programmable
-Analogue multiplexers
-Analogue multipliers/dividers
-Analogue switches
-Arrays
- diode
- transistor
-Energy metering
-Cables - Multiconductor
- computer, LAN
- instrumentation, control
- multipair
- shielded individual/overall
- temperature extremes
-Cables - coaxial
- flexible
- high temperature
- miniature
- rigid
- semi-rigid
- twin-axial
-Cables - flat
- antenna feed
- printed, ribbon
- woven
-Cables
- Harnesses
- High voltage
- Medical
- Microphone
- Optical fibre
- Power
- Retractile
- Thermocouple
-Installation accessories
- Ducting
- Glands, grommets
- Joining kits
- Lacing cords/ribbons
- Marking systems
- Mounting clips, clamps
- Powerskirting
- Shrink tubing
- Spiral wrap
- Strain reliefs
- Ties
- Zip tubing
-Wires
- Copper braid
- Hook-up
- Litz
- Magnet (winding) wire
- Nickel
- Tinsel
- Wrapping wire
-AC
-Battery replacement (high energy)
-Capacitor networks
-Ceramic
- axial lead
- chip format
- DIP
- radial lead
-Electrolytic
- aluminium
- chip format
- tantalum
-Feed-through
-Film (foil/metallised)
- polycarbonate
- polyester
- polypropylene
- polystyrene
- polysulfone
- teflon
-High voltage
-Memory support
-Motor start capacitors
-RFI suppression
-Board-to-board/backplane
- Board-to-board stacking
- Elastomeric
- High density (<2 mm)
- High speed data
- Metric spacing
- Milspec
- One piece
- Surface mount
- Two piece
-Board-to-cable/wire
- High density (<2 mm)
- IDC discrete wire
- Mass terminated (IDC) ribbon
- Milspec
- Receptacles and headers
- Surface mount
-Cable-to-cable/panel - Circular
- audio, video
- DIN
- hybrid (mixed contact)
- milspec
- modular insert
- power
- professional
-Cable-to-cable/panel - D-Subminiature
- accessories
- high density
- microminiature
- standard
-Cable-to-cable/panel - rectangular
- high density
- hybrid (mixed contact)
- low power, I/O
- milspec
- power
-Coaxial cable connectors
- Between series adapters
- BNC/TNC Series
- C Series
- Milspec
- Miniature (semi-rigid)
- N Series
- SHV (safe HV) Series
- SMA/SMB/SMC Series
- Std/miniature UHF
- Triaxial
- Twinaxial
-Connector support
- Cable assembly service
- Cable preparation tooling
- Database available
- Termination tooling
-Optical fibre
- Fibre bundle
- Hybrid (fibre + copper)
- Single fibre
-Special applications
- Automotive
- Avionics
- Elastomeric stacking
- EMI-filtered
- Flameproof
- Harsh environment
- High current
- High temperature
- High voltage
- Shielded
- Thermocouple
- Underwater
- Vehicle
-BiCMOS
-CMOS
-Converters
- ADCs
- Code
- DACs
-Graphics ICs
-Image processing
-Interface ICs
-Inverters
-Management ICs
-RS232 drivers
-Schmitt triggers
-SCSI chips
-Translators (TTL-CMOS-ECL)
-TTL
-Inductors
- High frequency (RF,IF,etc)
- SMD chips
- Transductors
-Transformers - power
- Constant voltage
- High voltage
- Mains input
- Switchmode (DC-DC)
-Transformers - signal
- Telecom specialised
Electronics & communications technology news: |
Microchip expands its mSiC solutions
28 March 2024, Power Electronics / Power Management, EBV Electrolink
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
|
Antennas to meet all connectivity requirements
28 March 2024, Telecoms, Datacoms, Wireless, IoT, Electrocomp
Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.
|
LoRaWAN-certified sub-GHz module
28 March 2024, Telecoms, Datacoms, Wireless, IoT, Altron Arrow
The STM32WL5M from ST Microelectronics is the company’s first LoRaWAN-certified module which incorporates two cores, one of them being a wireless stack to optimise the creation of sub-GHz applications.
|
Quectel announces module for RedCap comms
28 March 2024, Telecoms, Datacoms, Wireless, IoT, Quectel Wireless Solutions
The Quectel RG255G offers downlink performance of 220 Mbps, and uplink performance of 121 Mbps on 256QAM or 91 Mbps on 64QAM.
|
Duxbury launches a cellular coverage solution
28 March 2024, Telecoms, Datacoms, Wireless, IoT
Duxbury Networking has announced the South African availability of the Nextivity CEL-FI GO G43 multi-operator cellular coverage solution, that ensures customers and employees have reliable mobile coverage. |
3D depth sensing sensor
28 March 2024, Telecoms, Datacoms, Wireless, IoT, Avnet Silica
A recent announcement by STMicroelectronics has revealed an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with 2,3k resolution.
|
Dual-port USB-C power delivery solution
28 March 2024, Power Electronics / Power Management, Altron Arrow
Infineon’s CYPD7272-68LQXQ is the tray packing option of the company’s dual-port USB-C power delivery solution and features an integrated dual-port USB-C PD + DC-DC controller.
|
Service excellence with attention to detail
28 March 2024, Editor's Choice, Deman Manufacturing
The vision of industry pioneers Hugo de Bruyn and Charles Hauman led to the birth of Deman Manufacturing, a company that sets new standards for innovation and performance within the industry.
|
| visit www.dataweek.co.za |
|
|
|
|
|
