Electronics Buyers' Guide (EBG) - Directory of the South African Electronics Industry
Prime Technology Corp. SA

Shere AH, Shere, Pretoria East

cell:  
+27 76 880 7800
email:  
[email protected]
url:  
www.primetechnology.us

Iso Certification ISO 9001:2015, AS 9120B, EN 9120, SJAC 9120

Sale of: electronic components including military and aviation, land-based vehicle components and hardware, obsolete and hard-to-find items, stocking long lead-time electronic components. Merchandise and products manufactured in the USA.


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Section - Components
-Amplifiers
- audio power
- audio small signal
- current
- operational
- programmable
-Analogue multiplexers
-Analogue multipliers/dividers
-Analogue switches
-Arrays
- diode
- transistor
-Energy metering
-Cables - Multiconductor
- computer, LAN
- instrumentation, control
- multipair
- shielded individual/overall
- temperature extremes
-Cables - coaxial
- flexible
- high temperature
- miniature
- rigid
- semi-rigid
- twin-axial
-Cables - flat
- antenna feed
- printed, ribbon
- woven
-Cables
- Harnesses
- High voltage
- Medical
- Microphone
- Optical fibre
- Power
- Retractile
- Thermocouple
-Installation accessories
- Ducting
- Glands, grommets
- Joining kits
- Lacing cords/ribbons
- Marking systems
- Mounting clips, clamps
- Powerskirting
- Shrink tubing
- Spiral wrap
- Strain reliefs
- Ties
- Zip tubing
-Wires
- Copper braid
- Hook-up
- Litz
- Magnet (winding) wire
- Nickel
- Tinsel
- Wrapping wire
-AC
-Battery replacement (high energy)
-Capacitor networks
-Ceramic
- axial lead
- chip format
- DIP
- high-Q
- radial lead
-Electrolytic
- aluminium
- chip format
- high ripple
- tantalum
-Feed-through
-Film (foil/metallised)
- chip format
- polycarbonate
- polyester
- polypropylene
- polystyrene
- polysulfone
- teflon
-High voltage
-Memory support
-Motor start capacitors
-Paper (foil and metallised)
-RFI suppression
-Board-to-board/backplane
- Board-to-board stacking
- Elastomeric
- High density (<2 mm)
- High speed data
- Metric spacing
- Milspec
- One piece
- Surface mount
- Two piece
-Board-to-cable/wire
- High density (<2 mm)
- IDC discrete wire
- Mass terminated (IDC) ribbon
- Milspec
- Receptacles and headers
- Surface mount
-Cable-to-cable/panel - Circular
- audio, video
- DIN
- hybrid (mixed contact)
- milspec
- modular insert
- power
- professional
-Cable-to-cable/panel - D-Subminiature
- accessories
- high density
- microminiature
- standard
-Cable-to-cable/panel - rectangular
- high density
- hybrid (mixed contact)
- low power, I/O
- milspec
- power
-Coaxial cable connectors
- Between series adapters
- BNC/TNC Series
- C Series
- Milspec
- Miniature (semi-rigid)
- N Series
- SHV (safe HV) Series
- SMA/SMB/SMC Series
- Std/miniature UHF
- Triaxial
- Twinaxial
-Connector support
- Cable assembly service
- Cable preparation tooling
- Database available
- Termination tooling
-Optical fibre
- Fibre bundle
- Hybrid (fibre + copper)
- Single fibre
-Special applications
- Automotive
- Avionics
- Elastomeric stacking
- EMI-filtered
- Flameproof
- Harsh environment
- High current
- High temperature
- High voltage
- Shielded
- Thermocouple
- Underwater
- Vehicle
-BiCMOS
-CMOS
-Converters
- ADCs
- Code
- DACs
-Data acquisition systems ICs
-Encoders/decoders
-Graphics ICs
-Image processing
-Interface ICs
-Inverters
-Management ICs
-Microcomputer chipsets
-RS232 drivers
-Schmitt triggers
-SCSI chips
-Translators (TTL-CMOS-ECL)
-TTL
-Diodes
- Arrays
- Fast recovery
- Rectifier
- Schottky
-Power
- MOSFET
-Transistors
- Darlington
- Dual complementary
- HF/video
- High voltage
- Low noise
- VHF/UHF
-Inductors
- Audio frequency (filter, etc)
- Common mode
- High frequency (RF,IF,etc)
- Moulded RF chokes
- SMD chips
- Toroidal
- Transductors
-Transformers - power
- Constant voltage
- High voltage
- Mains input
- Switchmode (DC-DC)
- Toroidal
-Transformers - signal
- Telecom specialised
-Converters
- frequency-voltage
-Current transmitter ICs
-Drivers
- power MOSFET
- relay
- solenoid
- stepper motor
-Electricity metering ICs
-Multiplexers
-Power op amps
-Features available
- On-chip flash
- On-chip ROM/EPROM
- On-chip SRAM
- OTP
- Real-time clock
-Processor types
- Digital signal processors
-Battery holders
-Beryllium copper
-Ceramic parts
-Fasteners
-Magnetic cores
- ferrite transformer
-Screws and fasteners
-Carbon composition
-Carbon film
-Digital potentiometers (see Digital IC section)
-Wirewound
-AC-DC converters (IC)
-DC-DC converters (IC)
-PWM controllers
-Voltage regulators
- Adjustable
-Protection relays
- Over/under-frequency
-Electromagnetic
- Automotive
- General purpose, control
- Heavy duty/power switching
- High voltage
- Latching
- Surface mounting
-Reed relays
- Microminiature
-Solid-state
- General purpose
-Ceramic, bulk
-Film
- Carbon
- Metal film
-Surface mount
- Chip
- Power
-EEPROM (electrically erasable)
-EPROM (OTP)
-EPROM (UV erasable)
-Flash EEPROM
-Flash EPROM
Electronics & communications technology news:
SAPVIA hails R2bn credit guarantee fund for transmission expansion
27 November 2025, News

Soon after the mini budget was delivered in parliament, the South African Photovoltaic Industry Association (SAPVIA) congratulated Finance Minister, Enoch Godongwana, for the announcement of a R2 billion Credit Guarantee Vehicle.

Could the EU’s Cyber Resilience Act affect your electronics manufacturing business?
27 November 2025, Editor's Choice, Altron Arrow

South African companies exporting IoT devices to the European Union face a significant regulatory shift with the Cyber Resilience Act becoming mandatory in December 2027.

AI-based visual inspection system
27 November 2025, Manufacturing / Production Technology, Hardware & Services, ZETECH ONE

As industries embrace the era of smart automation, Siemens has introduced a groundbreaking innovation – the Inspekto AI-based visual inspection system.

Generative AOI programming
27 November 2025, Manufacturing / Production Technology, Hardware & Services, MyKay Tronics

Mycronic’s PCB Assembly Solution division has announced the launch of GenI, an industry first solution designed to liberate electronics manufacturers from the complexities of traditional Automated Optical Inspection programming.

High-performance processing at the edge
27 November 2025, DSP, Micros & Memory, Altron Arrow

STMicroelectronics’ STM32MP23 microprocessor is designed to meet the demands of industrial, IoT, and edge AI applications.

High-speed Flash for system-on-chip applications
27 November 2025, DSP, Micros & Memory, NuVision Electronics

GigaDevice unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V SoC applications.

Ultra-wide signal capture from a single chip
27 November 2025, DSP, Micros & Memory, RFiber Solutions

Jariet Technologies developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.

High-performance MCU with mesh communication
27 November 2025, Telecoms, Datacoms, Wireless, IoT, iCorp Technologies

The KGM133S is a high-performance by Quectel that boasts an ARM Cortex-M33 processor with a frequency of up to 78 MHz, and Matter, Thread, Zigbee, BLE 6.0, and BLE mesh.

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