Mycronic’s BA 01 small dot ejector delivers unmatched precision in solder paste jet printing for advanced PCB designs.

The PI series 3D SPI from Mycronic, measures paste volume with extreme precision and gives highly accurate SPI data, combined with a range of smart auto-programming functions that ensure high-quality inspection regardless of operator experience.

The Scienscope AXl-6100 series comprises specialised X-ray inspection systems explicitly engineered for the examination of long circuit boards.

The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.

The Aurora Reflow Oven Platform from BTU International is a next generation thermal processing system engineered for modern electronics manufacturing environments.

MyKay Tronics prides itself on not only supplying products and equipment in a growing electronic market, but to also supply the best service and support to its client base.

This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

The EMST Stallion fc - PLC is a highly capable wave soldering machine engineered for precision and productivity in electronics manufacturing.