At the recent PCI PlugFest held by the PCI Special Interest Group, Avnet Electronics Marketing, and Jungo Software Technologies successfully completed PCI-X compliance tests using the new PCI-X 64/133 ...

As 2G and 3G networks rapidly sunset across the globe, the Internet of Things (IoT) market faces a critical challenge: how to maintain reliable cellular connectivity without the complexity or cost of full 5G.

[Sponsored] Designing networks for the smart factory can seem daunting, but the solutions are already available with Samtec providing a comprehensive range of interconnect technologies tailored to the demands of the modern factory.

The SPE standard 10BASE-T1L in accordance with IEEE 802.3cg provides for a significantly longer transmission distance than Ethernet, with the standard defining an SPE transmission distance of up to 1000 m.

HARTING has launched its new D-Sub PushPull housings, designed to improve efficient and process-safe handling by transforming a well-known connector family into a simplified solution.

The connector series design by Glenair is optimised for fast and easy crimp-contact wire termination, with ample wiring space in the cable housing and accessory hardware.

TDK Corporation has expanded its ADL4524VL series (4,5 x 2,4 x 2,6 mm – L x W x H) of wire-wound inductors for automotive power-over-coax.

TDK has introduced 20 and 40 A, 80 V DC board-mount EMI filters, reducing differential mode conducted emissions for switching power supplies with high input current requirements.

A solder paste’s viscosity and thixotropic properties, a measure of its resistance to flow, influence its performance in different production environments.