The new UFS devices use KIOXIA’s 8th-Gen BiCS FLASH 3D to boost speed and power efficiency.

[Sponsored] Hosted by McKinsey Electronics, the summit introduced a new regional platform that placed engineering discussions at its core while recognising the growing role of policy, governance, and industrial strategy in semiconductor decision-making.

The DLA.01 DECT ceramic loop antenna from Taoglas is a miniature edge mounted antenna designed for compact devices with minimal space availability.

The latest Bluetooth module from Panasonic Industry provides excellent performance and minimal power consumption.

WAVEPIA’s latest GaN-on-SiC transistor, the WP2806015UH(S), delivers up to 15 W power from DC to 6 GHz at 28 V.

The FCU741R is a high-performance Wi-Fi 4 module launched by Quectel, supporting 2,4 and 5 GHz frequencies which can be used for WLAN connection.

ITT Cannon’s CA Bayonet connectors are a versatile and extremely reliable series with a proven ‘reverse bayonet’ coupling design that offers exceptional vibration protection.

The JILONG 280T All-Rounder Middle Trunk Line fusion splicer is a rugged, high-performance fibre optic fusion tool engineered for core networks, FTTx, and access infrastructure.