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Logica Technologies
101 Rykers Street, Clubview
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| News from Logica Technologies: |
High-speed USB/Ethernet oscilloscope
30 September 2009, Test & Measurement, Logica Technologies
The CS328A from CleverScope is a USB/Ethernet oscilloscope that combines a high level of performance with affordability and ease of use.
The scope is available with high resolution samplers of 10, 12 ... |
USB oscilloscope said to offer ease-of-use and affordability
30 May 2007, Test & Measurement, Logica Technologies
Logica Technologies is offering the CleverScope CS328A, a high performance USB oscilloscope that the company says offers numerous advantages not generally available in standalone oscilloscopes.
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High speed, high resolution and mega memory USB scope
2 May 2007, Test & Measurement, Logica Technologies
The CleverScope is available with high resolution samplers of 10, 12 and 14 bits, which eliminates the ‘jaggies’ or staircase effect commonly found in oscilloscopes using standard 8 bit samplers.
The ... |
In-circuit emulators for 8051 devices
28 August 2002, Design Automation, Logica Technologies
In-circuit emulators (ICEs) are essential tools in most software development cycles. They replace the microprocessor in the target system, giving the programmer full control over the target. The programmer ... |
Electronics & communications technology news: |
Innovative South African electronics system makes overseas debut
EMP 2026 Electronics Manufacturing & Production Handbook, News
Pretoria-based electronics company Etion Create is showing a new range of innovative solutions, including cybersecurity systems at the third edition of World Defense Show (WDS2026) in Riyadh, Saudi Arabia. |
The trillion-dollar energy opportunity in focus at the Africa Energy Indaba
27 November 2025, Events
The Indaba convenes senior government leaders, utilities, regulators, project developers, financiers, DFIs, investors, and technology providers from across Africa and the world to engage directly on investment-ready energy projects, enabling policy frameworks, and the partnerships required to unlock delivery at scale. |
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, MyKay Tronics
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry. |
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services, Editor's Choice, Testerion
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
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High-speed, high-resolution material deposition system
EMP 2026 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services
ioTech recently unveiled the io600 inline digital laser material deposition system at productronica 2025. |
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