Welcome to the July 2026 issue of Dataweek. As you can see from this introduction, Dataweek’s regular editor, Peter Howells, is on extended leave and I am filling the void in his editor’s column – hopefully without being too boring.

The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.

nRF Cloud identifies vulnerabilities in firmware and shows exactly which deployed devices are affected, empowering device manufacturers to address EU Cyber Resilience Act requirements.

As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

Microtronix South Africa cements its commitment to local manufacturing with ongoing investments in production capacity, skills development, and job creation.

IFA Berlin 4-8 September Berlin, Germany The IFA will showcase the latest in consumer electronics, home appliances, and technology. It creates a space where global innovators, thought leaders, and ...

Zetech One recently supplied and installed an Essegi Automation smart storage management solution, the Uniflex Series and Auto Incoming station, at Etion Create’s facility in Irene, Pretoria.

With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX CD 560-1, a zero per- and polyfluoroalkyl substance (PFAS) alternate silver filler die attach paste.