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EBV Electrolink
Building 13, Pinewood Office Park, 33 Riley Road, Woodmead
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Durban
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Johannesburg
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Cape Town
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| News from EBV Electrolink: |
Automotive Ethernet communications
27 November 2025, News, EBV Electrolink
EBV Elektronik has expanded its automotive solutions offering with Infineon’s Marvell Automotive Ethernet portfolio.
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KIOXIA sampling UFS 4.1 embedded Flash
27 November 2025, DSP, Micros & Memory, EBV Electrolink
The new UFS devices use KIOXIA’s 8th-Gen BiCS FLASH 3D to boost speed and power efficiency. |
KIOXIA pioneer new 3D Flash technology
27 November 2025, DSP, Micros & Memory, EBV Electrolink
KIOXIA Corporation and Sandisk Corporation pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
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Versatile range of camera modules
30 September 2025, Opto-Electronics, EBV Electrolink
The CAM-66GY pro-modules from ST are a full range of sample camera modules made for a seamless evaluation and integration of the VD66GY 1,5-megapixel colour image sensor. |
Elevate your motor control designs
30 September 2025, DSP, Micros & Memory, EBV Electrolink
Built on an Arm Cortex-M33 core running up to 180 MHz, the MCX A34 family combines high-performance math acceleration and advanced motor control subsystems to unlock efficient motor drive solutions. |
MCU for noisy environments
29 August 2025, DSP, Micros & Memory, EBV Electrolink
The MCX?E24X is a high-performance microcontroller family from NXP, engineered for industrial, automotive-like, and energy-focused environments. |
High-reliability isolation amplifiers
30 June 2025, Analogue, Mixed Signal, LSI, EBV Electrolink
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
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Dual-range IMU with edge processing
30 June 2025, Analogue, Mixed Signal, LSI, EBV Electrolink
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
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Chip provides concurrent dual connectivity
31 Jul 2025, Telecoms, Datacoms, Wireless, IoT, EBV Electrolink
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes. |
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