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EBV Electrolink
Building 13, Pinewood Office Park, 33 Riley Road, Woodmead
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Durban
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Johannesburg
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Cape Town
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News from EBV Electrolink: |
MCU for noisy environments
29 August 2025, DSP, Micros & Memory, EBV Electrolink
The MCX?E24X is a high-performance microcontroller family from NXP, engineered for industrial, automotive-like, and energy-focused environments. |
High-reliability isolation amplifiers
30 June 2025, Analogue, Mixed Signal, LSI, EBV Electrolink
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
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Dual-range IMU with edge processing
30 June 2025, Analogue, Mixed Signal, LSI, EBV Electrolink
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
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Chip provides concurrent dual connectivity
31 Jul 2025, Telecoms, Datacoms, Wireless, IoT, EBV Electrolink
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes. |
First NVMe SSD Built with 8th-gen BiCS FLASH
30 May 2025, Computer/Embedded Technology, EBV Electrolink
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
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IMU with dual-sensing capability
30 May 2025, Analogue, Mixed Signal, LSI, EBV Electrolink
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing. |
Battery monitoring and balancing IC
30 April 2025, Power Electronics / Power Management, EBV Electrolink
The TLE9009DQU from Infineon is a multi-channel battery monitoring and balancing IC crafted for Li-Ion battery packs.
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Power IC supplies 1650 W
28 March 2025, Power Electronics / Power Management, EBV Electrolink
Power Integrations has announced a two-fold increase in power output from the HiperLCS-2 chipset with the new device now being able to deliver up to 1650 W of continuous output power.
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KIOXIA pioneer new 3D Flash technology
28 March 2025, DSP, Micros & Memory, EBV Electrolink
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
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