|
|
EBV Electrolink
Building 13, Pinewood Office Park, 33 Riley Road, Woodmead
|
|
Durban
|
Johannesburg
|
|
Cape Town
|
| News from EBV Electrolink: |
Next-gen robotic systems initiative
28 April 2026, Design Automation, EBV Electrolink
EBV Elektronik recently introduced MOVE – Driving Robotics Forward, a new initiative designed by EBV Elektronik‘s Embedded Solutions team to support the development of next-generation robotic systems. |
Compact high-current power inductor
28 April 2026, Passive Components, EBV Electrolink
Vishay’s IHLP series power inductors deliver high current capability in an ultra-low profile, magnetically shielded design. |
High-performance FPGA family
28 February 2026, DSP, Micros & Memory, EBV Electrolink
AMD’s Kintex UltraScale+ FPGA family delivers high-performance, mid-range field programmable gate arrays that balance price, performance, and power efficiency for demanding DSP applications. |
High-efficiency 600 V power MOSFET
28 February 2026, Power Electronics / Power Management, EBV Electrolink
The Infineon Technologies 600 V CoolMOS CFD7 is a high-voltage, super-junction N-channel MOSFET technology designed to deliver outstanding efficiency and robust switching performance. |
Advanced pressure monitoring sensor
28 February 2026, Test & Measurement, EBV Electrolink
The Infineon KP497 is an advanced, highly integrated digital pressure sensor designed for demanding automotive and industrial applications, with a particular focus on battery management systems. |
Touch-enabled 32-bit MCU
30 March 2026, DSP, Micros & Memory, EBV Electrolink
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications. |
Highly integrated 24-channel mixed signal IC
30 March 2026, DSP, Micros & Memory, EBV Electrolink
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control. |
KIOXIA pioneer new 3D Flash technology
27 November 2025, DSP, Micros & Memory, EBV Electrolink
KIOXIA Corporation and Sandisk Corporation pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
|
Automotive Ethernet communications
27 November 2025, News, EBV Electrolink
EBV Elektronik has expanded its automotive solutions offering with Infineon’s Marvell Automotive Ethernet portfolio.
|
| > > more |
|
|
|
|
|