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Rebound Electronics
Rivergate House, Newbury Business Park, London Road, Newbury, Berkshire, UK
Iso Certification ISO 9001:2015, ISO 13485:2016. ISO 14001:2015
Sale of: a global independent distributor of electronic components. Custom end-to-end solutions designed to streamline every aspect of your supply chain is offered, from global sourcing and PPV cost savings to franchised alternatives and proactive risk management. A data-driven approach guarantees seamless access to high-quality components.
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Section - Components
-Accelerometers/gyroscopes
-Amplifiers
- audio power
- audio small signal
- buffer
- chopper
- compression
- current
- differential
- digitally controlled
- instrumentation
- isolation
- log/antilog
- microphone
- operational
- programmable
- sample and hold
- sense
- track and hold
- video
- voltage controlled
- wideband
-Analogue multiplexers
-Analogue multipliers/dividers
-Analogue switches
-Arrays
- diode
- transistor
-Comparators
-Consumer ICs
- audio
- radio
- TV/video
-Digitally controlled potentiometers
-Followers
-Haptic drivers
-Optocouplers/isolators
-Oscillators
-Voltage comparators
-Voltage references
-Ceramic
- axial lead
- chip format
- DIP
- high-Q
- radial lead
-Electric double layer
-Electrolytic
- aluminium
- chip format
- high ripple
- tantalum
-Film (foil/metallised)
- chip format
- paralene
- polycarbonate
- polyester
- polypropylene
- polystyrene
- polysulfone
- teflon
-High voltage
-Memory support
-Motor start capacitors
-Board-to-board/backplane
- Board-to-board stacking
- Elastomeric
- High density (<2 mm)
- High speed data
- Metric spacing
- Milspec
- One piece
- Surface mount
- Two piece
-Board-to-cable/wire
- High density (<2 mm)
- IDC discrete wire
- Mass terminated (IDC) ribbon
- Milspec
- Receptacles and headers
- Surface mount
-Cable-to-cable/panel - Circular
- audio, video
- DIN
- hybrid (mixed contact)
- milspec
- modular insert
- power
- professional
-Cable-to-cable/panel - D-Subminiature
- accessories
- high density
- microminiature
- standard
-Cable-to-cable/panel - rectangular
- high density
- hybrid (mixed contact)
- low power, I/O
- milspec
- power
-Coaxial cable connectors
- Between series adapters
- BNC/TNC Series
- C Series
- Milspec
- Miniature (semi-rigid)
- N Series
- SHV (safe HV) Series
- SMA/SMB/SMC Series
- Std/miniature UHF
- Triaxial
- Twinaxial
-Connector support
- Cable assembly service
-Special applications
- Automotive
- Avionics
- Elastomeric stacking
- EMI-filtered
- Flameproof
- Harsh environment
- High current
- High temperature
- High voltage
- Shielded
- Thermocouple
- Underwater
- Vehicle
-Application specific circuits
-Arithmetic functions
-Buffers
-Bus Controllers/Interfaces
-Clock oscillators/dividers
-CMOS
-Comparators (digital)
-Converters
- ADCs
- Code
- DACs
- Multichannel
-Counters
-Data acquisition systems ICs
-Delay line elements
-Direct digital synthesis
-Disk drive components
-Display drivers/controllers
-DSP functions
-ECL (emitter coupled logic)
-Encoders/decoders
-Flip-flops
-GaAs
-Graphics ICs
-Image processing
-Interface ICs
-Inverters
-Latches
-Line drivers/receivers
-Logic gates
-Low volt logic
-Management ICs
-MEMS
-Microcomputer chipsets
-Multiplexers
-Multivibrators
-Parity generators/checkers
-Peripheral drivers
-Pulse differentiators
-Pulse-width regulators
-Real-time clock/calendar
-RS232 drivers
-SCSI chips
-Shift registers
-Terminators - active
-Touch controllers
-Transceiver devices
-Translators (TTL-CMOS-ECL)
-Amplifier tubes
- high-frequency
- power
- small-signal
- transmitting
-Diodes
- Arrays
- Fast recovery
- FREDFET
- Gunn
- Impatt
- Noise source
- PIN
- PN junction
- Point contact
- Rectifier
- Schottky
- Shockley
- Step recovery
- Trigger
- Tunnel
- Varactor
- Zener regulator
-Electron tubes
- HV rectifiers
- Ignitrons
- Klystrons
- X-ray tubes
-Power
- Ge-bipolar
- IGBT
- IGBT modules
- IPMs
- MOSFET
- Rectifier modules
- Si-bipolar
-Thyristors/SCRs
-Transistors
- Darlington
- Dual complementary
- FET
- GTO thyristors
- HEMT
- HF/video
- High voltage
- Low noise
- Matched pairs
- SHF/microwave
- Small signal
- Unijunction
- VHF/UHF
-Triacs
-Amplifiers (erbium-doped)
-Bandpass filters (optical)
-Circulators
-Connectors
-Couplers
-Couplers WDM
-Isolators
-Multiplexers/duplexers
-Receiver (O-E) modules
- microwave (GHz) signals
- single channel
- telecom
-Switches
-Transmitter (E-O) modules
- instrumentation, sensor
- laser
- LED
- microwave (GHz) signals
- single channel
- telecom
-Inductors
- Audio frequency (filter, etc)
- Common mode
- CRT display magnetics
- HF suppressor chokes
- High frequency (RF,IF,etc)
- Moulded RF chokes
- Power filter chokes
- SMD chips
- SMPS inductors
- Toroidal
- Transductors
- Ultrathin
- Variable (tuning)
-Transformers - power
- Constant voltage
- Current measurement
- Flyback
- High voltage
- Isolation
- Mains input
- Saturable
- Split-bobbin
- Switchmode (DC-DC)
- Toroidal
- Variable, auto
-Transformers - signal
- Audio functions
- Balance-unbalance (balun)
- Buck-boost, HF
- IF
- Pulse (incl trigger)
- Telecom specialised
- TV deflection
-Converters
- frequency-voltage
- LVDT-digital
- resolver
- RMS-DC
- synchro
- voltage-frequency
-Current transmitter ICs
-Data acquisition system ICs
-Drivers
- lamp
- linear motor
- power MOSFET
- relay
- solenoid
- stepper motor
-Electricity metering ICs
-Electromagnetic display IC
-Fuzzy controller ICs
-Hall-effect devices
-IR remote control ICs
-IR sensor chips
-Motor control (DSP + memory)
-Motor speed controllers
-Multiplexers
-Opto-isolators
-Power op amps
-Pressure transducer ICs
-Servo amplifiers/controllers
-Signal conditioners
-Smoke detector ICs
-Strain-guage conditioners
-Switch - solid-state (SSR)
- I/O switching
- intelligent power control
- proportional control
-Temperature transducer
-Timers
-Touch control (dimmer, etc)
-CPU
- ARM
- CISC
- RISC
-Features available
- A-D conversion
- Application specific designs
- Bus driver
- Clock/calendar generator
- Counter(s)
- Customisable micro
- D-A conversion
- Display drivers (LCD, LED, VFT)
- DSP core
- Embeddable device
- Encryption/Decryption micros
- Fully integrated MCU module
- In-system flash programmable
- Interrupt priority/control
- Low voltage operation
- Memory expansion
- Modular core
- Motor control
- On-chip flash
- On-chip ROM/EPROM
- On-chip SRAM
- OTP
- Power management control
- Power save modes
- Real-time clock
- Timer(s)
-I/O features
- Analogue
- Digital
- External bus
- High speed digital
- Parallel
- Serial
-Microcontrollers
- 4-bit bus width
- 8-bit bus width
- 12/14/16-bit bus width
- 12-bit bus width
- 16/8-bit bus width
- 16-bit bus width
- 32-bit bus width
- 64-bit bus width
-Microprocessors
-Processor types
- Digital signal processors
- Fuzzy MCUs
- Math coprocessors
- Neural nodes
- Transputers
-Programmable system chips
-Light sensor ICs
-Opto-couplers
-Photo-diodes/arrays
-Photo-multipliers
-Photo-transistors
-Solid-state lighting
- arrays
- discrete LED/OLED
- light-emitting polymer
-Digital potentiometers (see Digital IC section)
-PCB mounting
-AC-DC converters (IC)
-DC-DC converters (IC)
-Drivers - power MOSFET
-Power regulators
- Phase control
-Rectifier bridges
-Resonant-mode controllers
-Switchmode controllers
-Voltage regulators
- Adjustable
- Fixed
- Linear
- Switching
-Electromagnetic
- Automotive
- Coaxial matrix
- Cradle
- Current sensing
- DIP/SIP
- Flasher
- General purpose, control
- Heavy duty/power switching
- High frequency/coaxial
- High isolation data
- High voltage
- Intrinsically safe
- Isolation
- Latching
- Low profile
- Miniature
- Multipole
- PCB mounting
- Plug-in
- Polarised
- Rail-mount modules
- Sealed/encapsulated
- Small signal
- Subminiature
- Surface mounting
- Telephone
- Time delay/control
- TO-5 can
- Vacuum/gas-filled
- Voltage sensing
-Reed relays
- Dry contact
- Low thermal EMF
- Mercury-wetted
- Microminiature
-Solid-state
- General purpose
- I/O switching
- Intelligent
- Photo MOS (photovoltaic)
- Zero-crossing
-Ceramic, bulk
-Cermet
-Current sensors
-Film
- Carbon
- Metal film
- Metal oxide
-Foil
-Fusible
-Hall-effect
-High voltage
-Networks
- (SIP, DIP)
- RC
-Non-inductive
-Power
- >10 W
- 2-5 W
- 5-10 W
-Precision
-Surface mount
- Chip
- Power
-Thermistor
-Varistor
-Voltage divider
-Wire-wound
-ARAM (audio)
-CAM (contact addressable)
-DRAM (dynamic)
-EEPROM (electrically erasable)
-EPROM (OTP)
-EPROM (UV erasable)
-Flash EEPROM
-Flash EPROM
-Flash memory cards
-Flash NAND
-FRAM (ferroelectric)
-IC memory cards
-Memory programmers
-NV SRAM (non-volatile)
-Parallel EEPROM
-PROM (fuse programmable)
-RDRAM (RAMbus)
-ROM (mask programmable)
-SDRAM (synchronous)
-Serial EEPROM
-VRAM (video)
-Coaxial/RF
-Code
-Crossbar
-DIP, multiple
-Keytop (PCB mounted)
-Signal
-Analogue line interfaces
-Datacoms processing ICs
-Digital line interfaces
-Interfacing ICs
-ISDN circuit ICs
-Modem ICs/set
-Networking function chips
-Telephone ICs/sets - Dialling circuits
-Telephone ICs/sets - Feature enhancement
-Telephone ICs/sets - Scrambling/encryption
-Telephone ICs/sets - Speech circuit
-Telephone ICs/sets - Tone ringer
-Terminal blocks - DIN railmount system
- Interface, modules
- Terminal blocks
-Terminal blocks - Moulded terminal steps
- Panel mounting
- PCB mounting
-Terminal blocks
- Panel mount blocks
- PCB-fixed blocks
- PCB-pluggable blocks & receptacles
- Tab connector blocks (panel, PCB)
- Thermocouple
-Terminals
- Coaxial cable terminators
- Grounding terminals
News from Rebound Electronics: |
Celebrating innovation, leadership, and the next generation
29 August 2025, Editor's Choice, Rebound Electronics
In electronics and engineering, women are not just participating; they are transforming, innovating, and shaping the future. |
Electronics & communications technology news: |
Celebrating innovation, leadership, and the next generation
29 August 2025, Editor's Choice, Rebound Electronics
In electronics and engineering, women are not just participating; they are transforming, innovating, and shaping the future. |
Why GNSS positioning precision is enabling the next wave of IoT applications
29 August 2025, Telecoms, Datacoms, Wireless, IoT, Editor's Choice, iCorp Technologies
While high-performance GNSS implementations are achievable with few limitations, most real-world applications must balance power consumption, form factor and accuracy requirements. |
Battery modules with lithium iron phosphate technology
29 August 2025, Enclosures, Racks, Cabinets & Panel Products, Phoenix Contact
With its new lithium battery modules with IQ Technology, Phoenix Contact is expanding its portfolio with powerful energy storage solutions with a capacity of 284 Wh. |
High-density multicoax assemblies
29 August 2025, Interconnection, RFiber Solutions
Withwave’s high speed and high-density multicoax cable assemblies provides a wide range of multiple coax connectors and flexible cable assemblies. |
Liquid cooling connectors improve thermal management
29 August 2025, Interconnection, Startech Industrial
The leak-free design and high flow rate of both series from Amphenol make the connectors ideal for high-reliability equipment that employ liquid cooling. |
Multi-config connector series
29 August 2025, Interconnection, Future Electronics
Hirose Electric’s DF11 Series is a versatile 2,0 mm pitch, double-row board-to-wire connector designed to simplify a wide range of connection needs. |
Ultra-rugged connector
29 August 2025, Interconnection, Hiconnex
Radiall has introduced a new connector for ribbon fibre connections called Fortero to provide proven performance in high-vibration, high-impact, and extreme environments. |
Mouser shares expert design solutions for advanced robotics development
29 August 2025, Interconnection
Mouser Electronics has announced a new interactive eBook, ‘The Electric Workforce’, in collaboration with electronics manufacturer and connectivity innovator, Molex. |
visit www.dataweek.co.za |
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