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Central Electronic Technologies
Unit 3 Rambo Junxion, Corporate Park North , 400 Roan Crescent, Midrand
Iso Certification ISO 9001 :2015
Sale of: printed circuit boards (PCBs), single-sided, double-sided, and multilayered, and 100% netlist tested. Meets any requirements for defence/mil- and aerospace-specifications, multilayer, flex and flex-rigid, aluminium and heatsink/thermal PCBs.
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Section - Production services & equipment
-Front end engineering
- Artwork generation - HPGL, Gerber input
- Artwork generation - laser plotting
- Artwork generation - mechanical drawing
- Artwork generation - modem input
- CNC drill data from - artwork and drawings
- CNC drill data from - excellon format data
- Phototool generation from - Gerber data
-PCB assembly services
- Board modification
- Component potting
- Depanelling
- Double-sided THT + SMT board assembly
-Production quantities
- Preproduction (5-50)
- Production (10-500)
- Prototypes (1-10)
- Samples (1-3)
- Volume (150 up)
-Quality standards, compliance
- BS
- IEC EMC compliance testing
- ISO
- MIL
- SABS
- UL
-Double-sided flexible
-Double-sided THP
-Edge profiling - CNC-routed
-Edge profiling - V-scribed
-Flex-rigid
-Gold edge connectors
-Gold-nickel edge connectors
-Heatsinks - internal, external
-Inspection & testing - automatic optical video
-Inspection & testing - electrical testing
-Inspection & testing - visual inspection
-Multilayer
-Panel scoring
-Production quantities
- Preproduction (5-50)
- Production (10-500)
- Prototypes (1-10)
- Samples (1-3)
- Volume (150 up)
-Quality standards, compliance
- BS
- ISO
- MIL
- UL
-Single-sided flexible
-Single-sided NTHP
-Solder masks - photo-imageable liquid
-Surface finish - fused tin-lead
-Surface finish - hot-air levelled
-Surface finish - solder through flux
-Surface mount technology
-PCB inspection
- Automatic optical/video comparators
-PCB testing
- Bare board (electrical)
Electronics & communications technology news: |
Ideal entry point into edge AI
29 May 2026, AI & ML, Avnet Silica
congatec has released new COM Express modules with Intel Core Series 3 processors for cost- and energy-optimised embedded computing applications.
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Robotics platform powers intelligent systems
29 May 2026, AI & ML, Vepac Electronics
The CEXD-INTRBL open robotics development system combines high-performance AI processing, sensor integration, and motion control into a compact embedded platform.
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Ultra-low-power smart metering
29 May 2026, Analogue, Mixed Signal, LSI, EBV Electrolink
ScioSense’s UFC23 sensor combines improved resolution and offset stability with ultra-low standby current, enabling high-end battery-powered water, heat, gas and leak detection meter designs. |
What happens when trust can no longer live only in software?
29 May 2026, Electronics Technology, Computer/Embedded Technology
[Sponsored] For years, many enterprise security architectures treated hardware primarily as the execution layer, while software handled authentication, access control and trust decisions. |
Introducing STM32CubeMX2
29 May 2026, Design Automation, Altron Arrow
STMicroelectronics has launched STM32CubeMX2, a new evolution of its popular configuration and code generation tool for STM32 microcontrollers. |
ESP32-S31 for advanced IoT
29 May 2026, DSP, Micros & Memory, iCorp Technologies
At the heart of the device is a dual-core 32-bit RISC-V MCU operating at up to 320 MHz, delivering 6,86 CoreMark/MHz performance with MMU support for efficient memory management.
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SensorGPT speeds intelligent IoT deployment
29 May 2026, AI & ML
TDK has introduced SensorGPT, a new technology designed to accelerate the deployment of intelligent edge AI and smart IoT applications by dramatically reducing reliance on real-world sensor data.
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Industrial vibration sensing simplified
29 May 2026, Analogue, Mixed Signal, LSI, Altron Arrow
The IIS3DWBG1 from STMicroelectronics is a high performance, three-axis digital vibration sensor engineered for demanding industrial applications where accurate motion monitoring is essential.
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