Electronics Buyers' Guide (EBG) - Directory of the South African Electronics Industry
Central Electronic Technologies

Unit 3, Rambo Junxion, 400 Roan Crescent, Corporate Park North , Midrand

tel:  
+27 12 665 4860
cell:  
+27 82 822 5622
email:  
[email protected]
url:  
www.cetpcb.com

Iso Certification ISO 9001 :2015

Sale of: printed circuit boards (PCBs), single-sided, double-sided, and multilayered, and 100% netlist tested. Meets any requirements for defence/mil- and aerospace-specifications, multilayer, flex and flex-rigid, aluminium and heatsink/thermal PCBs.


Koekemoer, Rudi
Managing Director
[email protected]
Linington, Wanda
General Manager
[email protected]
Sanders, Aaryn
Sales Manager
[email protected]
van Schalkwyk, Dirk
Engineering Manager
[email protected]
Section - Production services & equipment
-Front end engineering
- Artwork generation - HPGL, Gerber input
- Artwork generation - laser plotting
- Artwork generation - mechanical drawing
- Artwork generation - modem input
- CNC drill data from - artwork and drawings
- CNC drill data from - excellon format data
- Phototool generation from - Gerber data
-PCB assembly services
- Board modification
- Component potting
- Depanelling
- Double-sided THT + SMT board assembly
-Production quantities
- Preproduction (5-50)
- Production (10-500)
- Prototypes (1-10)
- Samples (1-3)
- Volume (150 up)
-Quality standards, compliance
- BS
- IEC EMC compliance testing
- ISO
- MIL
- SABS
- UL
-Double-sided flexible
-Double-sided THP
-Edge profiling - CNC-routed
-Edge profiling - V-scribed
-Flex-rigid
-Gold edge connectors
-Gold-nickel edge connectors
-Heatsinks - internal, external
-Inspection & testing - automatic optical video
-Inspection & testing - electrical testing
-Inspection & testing - visual inspection
-Multilayer
-Panel scoring
-Production quantities
- Preproduction (5-50)
- Production (10-500)
- Prototypes (1-10)
- Samples (1-3)
- Volume (150 up)
-Quality standards, compliance
- BS
- ISO
- MIL
- UL
-Single-sided flexible
-Single-sided NTHP
-Solder masks - photo-imageable liquid
-Surface finish - fused tin-lead
-Surface finish - hot-air levelled
-Surface finish - solder through flux
-Surface mount technology
-PCB inspection
- Automatic optical/video comparators
-PCB testing
- Bare board (electrical)
Electronics & communications technology news:
AI-ready edge MPU for HMIs
31 July 2026, DSP, Micros & Memory, Future Electronics

The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Bridging the gap between prototype and production
31 July 2026, DSP, Micros & Memory

Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Compact direct Time-of-Flight 3D LiDAR module
31 July 2026, DSP, Micros & Memory, AI & ML, Altron Arrow

The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Precision jet printing for advanced PCB designs
31 July 2026, Manufacturing / Production Technology, Hardware & Services, MyKay Tronics

Mycronic’s BA 01 small dot ejector delivers unmatched precision in solder paste jet printing for advanced PCB designs.

Unleash the next generation of Intel Core power
31 July 2026, Computer/Embedded Technology, Vepac Electronics

The EPIC-BTS9 from AAEON, is tailor-made to bring unprecedented performance to smart manufacturing and industrial robotics.

QMC series I/O modules for VITA 93 small form factor mezzanine
31 July 2026, Computer/Embedded Technology, Rugged Interconnect Technologies

The new line of VITA 93 QMC mezzanine modules, from Acromag, are engineered to meet increasing demands for smaller form factors and more performance.

Landis+Gyr EMEA introduces new company name: EYKON
31 July 2026, News

EYKON is the new company name of Landis+Gyr EMEA, formerly part of the Landis+Gyr Group. The company supports electricity, gas, water and thermal utilities in managing increasingly complex networks, improving operational efficiency and enabling more sustainable use of resources.

Yamaha Robotics will show visitors to EFX
31 July 2026, News, Manufacturing / Production Technology, Hardware & Services

Yamaha Robotics will show visitors to EFX 2026, the Expo for Electronics Manufacturing, in Stuttgart from 6-8 October 2026, how advanced surface-mount automation helps companies grow their business and increase productivity.

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