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Central Electronic Technologies
Unit 3 Rambo Junxion, Corporate Park North , 400 Roan Crescent, Midrand
Iso Certification ISO 9001 :2015
Sale of: printed circuit boards (PCBs), single-sided, double-sided, and multilayered, and 100% netlist tested. Meets any requirements for defence/mil- and aerospace-specifications, multilayer, flex and flex-rigid, aluminium and heatsink/thermal PCBs.
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Section - Production services & equipment
-Front end engineering
- Artwork generation - HPGL, Gerber input
- Artwork generation - laser plotting
- Artwork generation - mechanical drawing
- Artwork generation - modem input
- CNC drill data from - artwork and drawings
- CNC drill data from - excellon format data
- Phototool generation from - Gerber data
-PCB assembly services
- Board modification
- Component potting
- Depanelling
- Double-sided THT + SMT board assembly
-Production quantities
- Preproduction (5-50)
- Production (10-500)
- Prototypes (1-10)
- Samples (1-3)
- Volume (150 up)
-Quality standards, compliance
- BS
- IEC EMC compliance testing
- ISO
- MIL
- SABS
- UL
-Double-sided flexible
-Double-sided THP
-Edge profiling - CNC-routed
-Edge profiling - V-scribed
-Flex-rigid
-Gold edge connectors
-Gold-nickel edge connectors
-Heatsinks - internal, external
-Inspection & testing - automatic optical video
-Inspection & testing - electrical testing
-Inspection & testing - visual inspection
-Multilayer
-Panel scoring
-Production quantities
- Preproduction (5-50)
- Production (10-500)
- Prototypes (1-10)
- Samples (1-3)
- Volume (150 up)
-Quality standards, compliance
- BS
- ISO
- MIL
- UL
-Single-sided flexible
-Single-sided NTHP
-Solder masks - photo-imageable liquid
-Surface finish - fused tin-lead
-Surface finish - hot-air levelled
-Surface finish - solder through flux
-Surface mount technology
-PCB inspection
- Automatic optical/video comparators
-PCB testing
- Bare board (electrical)
Electronics & communications technology news: |
Dual wireless connectivity in a compact package
27 November 2025, Telecoms, Datacoms, Wireless, IoT, iCorp Technologies
In the fast-moving world of embedded connectivity, Quectel’s FCS950R emerges as a compelling option for designers seeking both Wi-Fi and Bluetooth in a very compact footprint.
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High-accuracy time transfer solution
27 November 2025, Telecoms, Datacoms, Wireless, IoT, ASIC Design Services
Microchip Technology recently announced the release of the TimeProvider 4500 v3 grandmaster clock (TP4500) designed to deliver sub-nanosecond accuracy for time distribution across 800 km long-haul optical transmission.
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MACOM expands GaN portfolio with high-efficiency power amplifiers
27 November 2025, Telecoms, Datacoms, Wireless, IoT, RFiber Solutions
MACOM Technology Solutions continues to strengthen its position in high-frequency power solutions with three new GaN-on-SiC high-power amplifiers.
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Multichannel digitisers
27 November 2025, Test & Measurement, Vepac Electronics
Spectrum Instrumentation has released new flagship digitisers with 12-bit resolution and a maximum of 6 channels at 10 GS/s or 12 channels at 5 GS/s acquisition speed.
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High-power DC-DC converters
27 November 2025, Power Electronics / Power Management, Avnet Abacus
Vicor’s power modules range in power levels from 750 W up to 2 kW, with a top power density of 5 kW/in3.
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Power MOSFET in a PowerFLAT package
27 November 2025, Power Electronics / Power Management, Future Electronics
The ST8L60N065DM9 from STMicroelectronics is a 600 V N-channel Super-Junction power MOSFET that offers excellent performance in a compact surface-mount package. |
How dispatchable power and grid readiness are redefining the global landscape
27 November 2025, Power Electronics / Power Management
No longer defined by megawatt capacity alone, solar projects are now being evaluated on their ability to deliver dispatchable power, enhance grid stability, and provide critical ancillary services. |
Precision in next-gen asset tracking
27 November 2025, Telecoms, Datacoms, Wireless, IoT, Electrocomp
KYOCERA AVX’s advanced antenna technologies have been engineered specifically for compact, high-performance tracking devices.
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