By considering factors such as mechanical headroom, damping, and system-level robustness, designers can ensure that the chosen sensor not only survives, but performs reliably over time.

MeiG Smart has launched its first 5G Mobile HotSpot solution, the SRT8710, a breakthrough in mobile connectivity that combines ultra-fast 5G communications with integrated multimodal artificial intelligence functions.

The Panasonic TOUGHBOOK 33 is a fully rugged 12-inch 2-in-1 detachable notebook designed to deliver unmatched flexibility, durability, and performance for mobile professionals working in demanding environments.

AMD’s Kintex UltraScale+ FPGA family delivers high-performance, mid-range field programmable gate arrays that balance price, performance, and power efficiency for demanding DSP applications.

The AD9084 from Analog Devices integrates a quad 16-bit RF digital-to-analogue converter with a maximum sampling rate of 28 GSPS and a quad 12-bit RF analogue-to-digital converter.

TE Connectivity’s DEUTSCH connector range offers high-performance interconnect solutions engineered for demanding environments where reliability and durability are essential.

Mill-Max has introduced an expansion to its Omniball spring-loaded contact range with a new series of through-hole mount Omniball pins designed for robust and versatile interconnect solutions.

         Vacuum forming ESD Electronic components can be damaged by electrostatic discharges. To protect against such damage, electronic assembly parts are often transported or stored in vacuum formed component ...