Electronics Buyers' Guide (EBG) - Directory of the South African Electronics Industry
Central Electronic Technologies

Unit 3 Rambo Junxion, Corporate Park North , 400 Roan Crescent, Midrand

tel:  
+27 12 665 4860
cell:  
+27 82 822 5622
email:  
[email protected]
url:  
www.cetpcb.com

Iso Certification ISO 9001 :2015

Sale of: printed circuit boards (PCBs), single-sided, double-sided, and multilayered, and 100% netlist tested. Meets any requirements for defence/mil- and aerospace-specifications, multilayer, flex and flex-rigid, aluminium and heatsink/thermal PCBs.


Koekemoer, Rudi
Managing Director
[email protected]
Linington, Wanda
General Manager
[email protected]
Sanders, Aaryn
Sales Manager
[email protected]
van Schalkwyk, Dirk
Engineering Manager
[email protected]
Section - Production services & equipment
-Front end engineering
- Artwork generation - HPGL, Gerber input
- Artwork generation - laser plotting
- Artwork generation - mechanical drawing
- Artwork generation - modem input
- CNC drill data from - artwork and drawings
- CNC drill data from - excellon format data
- Phototool generation from - Gerber data
-PCB assembly services
- Board modification
- Component potting
- Depanelling
- Double-sided THT + SMT board assembly
-Production quantities
- Preproduction (5-50)
- Production (10-500)
- Prototypes (1-10)
- Samples (1-3)
- Volume (150 up)
-Quality standards, compliance
- BS
- IEC EMC compliance testing
- ISO
- MIL
- SABS
- UL
-Double-sided flexible
-Double-sided THP
-Edge profiling - CNC-routed
-Edge profiling - V-scribed
-Flex-rigid
-Gold edge connectors
-Gold-nickel edge connectors
-Heatsinks - internal, external
-Inspection & testing - automatic optical video
-Inspection & testing - electrical testing
-Inspection & testing - visual inspection
-Multilayer
-Panel scoring
-Production quantities
- Preproduction (5-50)
- Production (10-500)
- Prototypes (1-10)
- Samples (1-3)
- Volume (150 up)
-Quality standards, compliance
- BS
- ISO
- MIL
- UL
-Single-sided flexible
-Single-sided NTHP
-Solder masks - photo-imageable liquid
-Surface finish - fused tin-lead
-Surface finish - hot-air levelled
-Surface finish - solder through flux
-Surface mount technology
-PCB inspection
- Automatic optical/video comparators
-PCB testing
- Bare board (electrical)
Electronics & communications technology news:
High-precision smart reflow oven platform
30 March 2026, Manufacturing / Production Technology, Hardware & Services, MyKay Tronics

The Aurora Reflow Oven Platform from BTU International is a next generation thermal processing system engineered for modern electronics manufacturing environments.

Yamaha extends surface-mount software toolkit
30 March 2026, Manufacturing / Production Technology, Hardware & Services, Truth Electronic Manufacturing

The new tool, Print Param Decision Assist, automatically inspects the board file when loaded to calculate ideal printing parameters and troubleshoot existing settings.

Nordic accelerates cellular IoT leadership
30 March 2026, Telecoms, Datacoms, Wireless, IoT, RF Design

The company unveiled its next-generation portfolio featuring Cat 1 bis, satellite NTN, and advanced LTE-M/NB-IoT with edge AI, delivering secure and resilient connectivity across billions of IoT devices.

Powering the future of industrial automation
30 March 2026, Telecoms, Datacoms, Wireless, IoT, IOT Electronics

5G, the 5th generation of wireless broadband technology, enables users to establish reliable connectivity, which in turn enables flexible, autonomous, and efficient processes from production to logistics.

Strategic agreement for eSIM solutions
30 March 2026, Telecoms, Datacoms, Wireless, IoT, Avnet Silica

This agreement between Avent Silica and Thales covers the latter’s eSIM solutions that are compliant with GSMA SGP.22 and SGP.32 standards.

Inventec enhances design for manufacturing excellence with Siemens’ software
30 March 2026, Manufacturing / Production Technology, Hardware & Services, ASIC Design Services

Siemens recently announced that Inventec Corporation has adopted Siemens’ Valor NPI software and Process Preparation X solutions from the Siemens Xcelerator portfolio to strengthen its design-for-manufacturing efficiency.

The new role of UPS technology in high-precision automation
30 March 2026, Power Electronics / Power Management, Omron Electronics

OMRON’s BU_2SW and BU_2RWL series UPS systems are engineered to offer a robust, online type power architecture designed to safeguard sensitive AC powered systems across a wide range of industries.

Smarter compact automation with LOGO! 9
30 March 2026, Programmable Logic, RS South Africa

Siemens recently announced LOGO! 9, the latest generation of its compact logic controller designed for small automation projects in both industrial and building applications.

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