As we welcome the first issue of Dataweek in a new year, it is an exciting time to be part of the electronics community, especially for our readers. The pace of change across our industry continues to accelerate, reshaping how we design, build, and interact with technology.

European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.

The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.

NXP has significantly expanded its MCX A Series of Arm Cortex-M33 microcontrollers, doubling the portfolio with six new families aimed at industrial and IoT edge applications.

MIKROE has signed a multi-year MCU development tool support deal with Renesas, which commits MIKROE to providing development tools for 500 of Renesas’ most popular MCUs.

There are several common methods of implementing SDR architectures. This paper discusses which is best when meeting a specific need.

The Quad-Apollo MxFE reference design exemplifies a complete, high-performance platform for every-element direct-RF sampling digital beamforming using Analog Devices’ Apollo mixed-signal front-end technology.

TE Connectivity’s shielding solutions include electrically conductive elastomers, gaskets, knitted wire mesh, oriented wire, EMI shielding ventilation panels, shielded window, cable shielding and shielding components.