ASMPT’s SIPLACE TX seamlessly integrates into the company’s intelligent factory concept through standard interfaces and a growing number of automation options.

Absolute precision and maximum performance have made ASMPT’s SIPLACE X S the placement platform of choice for demanding high-volume production applications.

Soldering with wire and iron leaves process judgments up to individual operators, and can produce a wide variety of defects, scrap, or long-term quality issues.

The DEK TQ printing platform is superfast, with a core cycle time of only 5 to 6,5 s, and provides outstanding flexibility.

The SIPLACE SX is a leading placement platform for high-mix electronics production, where even odd-shaped components can be placed with exceptional reliability.

South African EMS specialist, Jemstech, has expanded its SMT capacities with two of ASM’s SIPLACE SX2 placement machines forming a separate production line for high-mix applications. The result is maximised ...

Espressif Systems is entering the Wi-Fi 6E market, extending its connectivity portfolio into the domain of high-throughput, low-latency wireless solutions.

Quectel’s FCS950R is a high-performance Wi-Fi 5 and Bluetooth 4.2 module that can deliver a maximum data rate up to 433,3 Mbps in 802.11ac mode.

The nRF54LM20A from Nordic Semiconductor is a multiprotocol wireless System-on-Chip designed for demanding designs in Bluetooth devices.