As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

IFA Berlin 4-8 September Berlin, Germany The IFA will showcase the latest in consumer electronics, home appliances, and technology. It creates a space where global innovators, thought leaders, and ...

The OPERA Series, a new generation of test solutions from Seica, is designed to meet the increasing complexity of modern electronics manufacturing.

With billions of rechargeable and non-rechargeable lithium cells and batteries powering most of the world’s consumer and industrial electronic devices, shipping them to customers through vast global logistics chains is often an overlooked topic.

With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX CD 560-1, a zero per- and polyfluoroalkyl substance (PFAS) alternate silver filler die attach paste.

SemiQ’s half-bridge series for data centre power converters and industrial motor drives features low RDSON SiC MOSFETs and parallel SBD diodes for best-in-class power density and conversion efficiency.

The IR315 combines 4G LTE, Wi-Fi, Ethernet, and VPN technologies into a rugged, industrial-grade platform that enables seamless connectivity across a wide range of applications.

The new ITECH IT8900G/L high-speed, high-power DC electronic load offers a powerful combination of speed, scalability, precision and high-power density.