This year’s highly successful Engineering Community Conference hosted by technology specialist, ESTEQ at the CSIR International Conference Centre focused on how to future-proof your businesses, ideas, ...

The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Mycronic’s BA 01 small dot ejector delivers unmatched precision in solder paste jet printing for advanced PCB designs.

The EPIC-BTS9 from AAEON, is tailor-made to bring unprecedented performance to smart manufacturing and industrial robotics.

The new line of VITA 93 QMC mezzanine modules, from Acromag, are engineered to meet increasing demands for smaller form factors and more performance.

EYKON is the new company name of Landis+Gyr EMEA, formerly part of the Landis+Gyr Group. The company supports electricity, gas, water and thermal utilities in managing increasingly complex networks, improving operational efficiency and enabling more sustainable use of resources.

Yamaha Robotics will show visitors to EFX 2026, the Expo for Electronics Manufacturing, in Stuttgart from 6-8 October 2026, how advanced surface-mount automation helps companies grow their business and increase productivity.