This year’s highly successful Engineering Community Conference hosted by technology specialist, ESTEQ at the CSIR International Conference Centre focused on how to future-proof your businesses, ideas, ...

The Aurora Reflow Oven Platform from BTU International is a next generation thermal processing system engineered for modern electronics manufacturing environments.

The new tool, Print Param Decision Assist, automatically inspects the board file when loaded to calculate ideal printing parameters and troubleshoot existing settings.

The company unveiled its next-generation portfolio featuring Cat 1 bis, satellite NTN, and advanced LTE-M/NB-IoT with edge AI, delivering secure and resilient connectivity across billions of IoT devices.

5G, the 5th generation of wireless broadband technology, enables users to establish reliable connectivity, which in turn enables flexible, autonomous, and efficient processes from production to logistics.

This agreement between Avent Silica and Thales covers the latter’s eSIM solutions that are compliant with GSMA SGP.22 and SGP.32 standards.

Siemens recently announced that Inventec Corporation has adopted Siemens’ Valor NPI software and Process Preparation X solutions from the Siemens Xcelerator portfolio to strengthen its design-for-manufacturing efficiency.

OMRON’s BU_2SW and BU_2RWL series UPS systems are engineered to offer a robust, online type power architecture designed to safeguard sensitive AC powered systems across a wide range of industries.

Siemens recently announced LOGO! 9, the latest generation of its compact logic controller designed for small automation projects in both industrial and building applications.