The PIC18-Q20 8-bit microcontrollers from Microchip easily interface with devices operating in multiple voltage domains, and the built-in I3C interface supports higher-speed and lower-power data transfers than I2C.
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Digi XBee XR 868 RF Modules support the deployment of long-range connectivity applications, and support point-to-point and mesh networking protocols.
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A recent announcement by STMicroelectronics has revealed an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with 2,3k resolution.
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STMicroelectronics and Mobile Physics have joined forces to create EnviroMeter for accurate air-quality monitoring on smartphones. Time-of-flight optical sensing enables an accurate personal air quality monitor and smoke detector.
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Avnet Silica franchise distribution agreement with open-source electronics provider strengthens Avnet’s global market portfolio.
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Avnet Silica, an Avnet company, was shortlisted in the 2023 European Excellence Awards, which honour the outstanding creativity and achievements of PR and communications professionals in Europe.
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The LPS22DF from STMicroelectronics is an ultracompact, piezoresistive, absolute pressure sensor that functions as a digital output barometer.
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Each IoT device must have a unique identifier assigned during manufacturing or provisioning which serves as the anchor for device identification, authentication, and communication.
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Leading the way in I3C integration, Microchip Technology has released its PIC18-Q20 family of microcontrollers, the industry’s first low pin count MCUs with up to two I3C peripherals.
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New software for STMicroelectronics’ STM32H5 MCUs leverages its advanced Secure Manager for protected connection to the Microsoft Azure cloud IoT platform.
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Panasonic Industry and Symbiotech have released a new Wirepas Mesh demo kit for BLE flagship module PAN1780, enabling IoT applications to easily setup a mesh network.
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With advanced CMOS technology and 1ß process technology, Micron’s HBM3 Gen2 provides bandwidth that exceeds 1,2 TB/s.
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