| News from Future Electronics: |
Next generation HMI processing platform
28 April 2026, DSP, Micros & Memory, Future Electronics
Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles. |
MIL-spec connector series
28 April 2026, Interconnection, Future Electronics
The MIL-HD2 connector series from Amphenol is the company’s next-generation, SOSA-aligned solution engineered to meet the most demanding requirements of modern military embedded systems. |
Next-generation HMI and vision processing
28 April 2026, Edge Computing & IIoT, Future Electronics
The Renesas RA8D2 group of microcontrollers delivers ultra-high performance for next-generation graphics, HMI, and vision-driven designs that demand fast response, rich visual interfaces, and embedded AI capability.
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Chip for high-density power
28 April 2026, DSP, Micros & Memory, Future Electronics
Microchip’s dsPIC33AK256MPS306 Digital Signal Controllers combine high-resolution control, high-speed analogue, and security with support for post-quantum cryptography. |
Compact power MOSFET for high current switching
28 February 2026, Power Electronics / Power Management, Future Electronics
onsemi’s NTMFSC2D6N08X is a high-performance 80 V N-channel power MOSFET engineered for demanding switching and power conversion applications. |
Standalone USB PD controller
28 February 2026, Power Electronics / Power Management, Future Electronics
The STUSB4531 from STMicroelectronics is a standalone USB Power Delivery sink controller designed to streamline the implementation of USB-C power negotiation in sink devices without requiring a full software stack on a host microcontroller. |
Wide input step-down DC-DC converter
28 February 2026, Power Electronics / Power Management, Future Electronics
The DCP3601 from STMicroelectronics is a wide-input, synchronous step-down DC-DC converter designed for compact and efficient power conversion in industrial and embedded systems. |
Connector range for demanding environments
28 February 2026, Interconnection, Future Electronics
TE Connectivity’s DEUTSCH connector range offers high-performance interconnect solutions engineered for demanding environments where reliability and durability are essential. |
Compact high precision magnetometer
28 February 2026, Test & Measurement, Future Electronics
Bosch Sensortec has introduced the BMM350, a compact 16-bit, 3-axis magnetometer engineered to deliver high accuracy, low noise, and exceptional energy efficiency in space constrained designs. |
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